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SSTU32864EC/G

Texas Instruments

SSTU32864EC/G by Texas Instruments

SSTU32864EC/G by Texas Instruments is a CMOS logic IC with 96 terminals in a grid array package. It operates b/w 0-70°C, with a supply voltage of 1.8V. Ideal for applications requiring fine pitch surface mount technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,143 parts In-Stock

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Digiode

USA . 4,025 parts In-Stock

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Anansix

USA . 1,187 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 66 parts In-Stock

1+ parts

$10.819

100+ parts

$10.711

1k+ parts

$10.278

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66

$10.819

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$10.278

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One Stop Electronics

USA . 1,294 parts In-Stock

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$16.000

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$16.000

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AZTECH Wire

Italy . 574 parts In-Stock

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$17.099

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574

$17.099

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Parana Technologies

USA . 2,323 parts In-Stock

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$23.075

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$23.717

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$23.075

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$23.717

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DigiPath Technology Company

USA . 2,269 parts In-Stock

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$25.408

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2,269

$25.408

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ChromeModa Solutions

Germany . 3,035 parts In-Stock

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$25.927

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$21.260

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$25.927

$21.260

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IDEA Electronic Components Group

UK . 1,110 parts In-Stock

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$25.927

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$24.631

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$23.334

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1,110

$25.927

$24.631

$23.334

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Ampacity Inc.

Singapore . 1,084 parts In-Stock

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$64.000

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Component Stockers USA

USA . 492 parts In-Stock

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$99.990

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492

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UNI Independent Distributors

Spain . 4,442 parts In-Stock

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Corphita

USA . 3,645 parts In-Stock

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Perfect Parts

USA . 1,197 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the Texas Instruments SSTU32864EC/G. Renowned for their superior quality and reliability, Texas Instruments delivers cutting-edge solutions in the Other Function Logic ICs category. This innovative product boasts a wide range of applications, offering customers unparalleled performance and versatility. Experience the value and benefits of this advanced technology, from its efficient power management to its seamless integration into your designs. Elevate your projects with the Texas Instruments SSTU32864EC/G and take your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material makes the product durable and reliable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 1.8

The low voltage requirement of 1.8V makes this product energy-efficient and suitable for low-power applications.

No. of Terminals: 96

With 96 terminals available, this product offers versatility in connectivity options and compatibility with various systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures stability and performance even in challenging environments.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making this product efficient and reliable.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8mm allows for high density mounting and compact design, ideal for space-constrained applications.

Technical Specifications

Other Function Logic ICs SSTU32864EC/G attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PBGA-B96

Logic IC Type:

No. of Terminals:

96

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.8

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Trade Compliance

SSTU32864EC/G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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