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74LVC1G57GM

NXP Semiconductors

74LVC1G57GM by NXP Semiconductors

NXP Semiconductors' 74LVC1G57GM is a CMOS logic IC with 7.9ns propagation delay, suitable for automotive applications. Operating at 1.8V, it has a max supply voltage of 5.5V and can handle load capacitance of 50pF, making it ideal for surface mount designs in compact spaces.

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Lifecycle Status

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Chip Stock

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AZTECH Wire

Italy . 12,801 parts In-Stock

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Aztec Data Supply Inc.

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Overview

Experience the cutting-edge technology of NXP Semiconductors with the 74LVC1G57GM, a high-quality Other Function Logic IC that offers exceptional performance and reliability. Ideal for automotive applications, this small outline, very thin profile package delivers a fast propagation delay and low power consumption, making it the perfect choice for your design needs. With a wide supply voltage range and Schmitt Trigger feature, this product provides unmatched value and versatility for your projects. Upgrade to NXP Semiconductors and elevate your electronic designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 7.9 ns

Fast propagation delay ensures efficient and quick signal processing, making the product suitable for time-critical applications.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and simplifying assembly processes.

Nominal Supply Voltage: 1.8 V

Operates efficiently at a low supply voltage, making it energy-efficient and suitable for battery-operated devices.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making the product suitable for use in challenging environmental conditions.

Minimum Operating Temperature: -40 °C

Can operate in cold temperatures, ensuring functionality in a wide range of environments.

Technology: CMOS

Utilizes CMOS technology which offers low power consumption, high noise immunity, and compatibility with a wide range of devices.

Technical Specifications

Other Function Logic ICs 74LVC1G57GM attributes and parameters. Explore more Other Function Logic ICs devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

1.45 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.9 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.5 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

74LVC1G57GM Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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