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SN74TVC3010DBQ

Texas Instruments

SN74TVC3010DBQ by Texas Instruments

SN74TVC3010DBQ by Texas Instruments is a 24-terminal logic IC with a supply voltage range of 0.6V to 5V, suitable for industrial applications. It features NMOS technology, operates b/w -40°C to 85°C, and has a small outline package style. This device is designed for surface mount assembly in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,590 parts In-Stock

1+ parts

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6,590

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Digiode

USA . 1,642 parts In-Stock

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1,642

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 614 parts In-Stock

1+ parts

$9.000

100+ parts

-

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614

$9.000

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Parana Technologies

USA . 1,505 parts In-Stock

1+ parts

$9.386

100+ parts

-

1k+ parts

$10.003

10k+ parts

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1,505

$9.386

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$10.003

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AZTECH Wire

Italy . 445 parts In-Stock

1+ parts

$10.020

100+ parts

-

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445

$10.020

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DigiPath Technology Company

USA . 1,871 parts In-Stock

1+ parts

$10.335

100+ parts

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1,871

$10.335

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ChromeModa Solutions

Germany . 6,279 parts In-Stock

1+ parts

$10.546

100+ parts

$8.648

1k+ parts

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10k+ parts

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6,279

$10.546

$8.648

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IDEA Electronic Components Group

UK . 867 parts In-Stock

1+ parts

$10.546

100+ parts

$10.019

1k+ parts

$9.491

10k+ parts

-

867

$10.546

$10.019

$9.491

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Corphita

USA . 3,338 parts In-Stock

1+ parts

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3,338

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Kepictronics

USA . 308 parts In-Stock

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308

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Overview

Enhance your electronic projects with the SN74TVC3010DBQ by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers innovative solutions for various applications in the Other Function Logic ICs category. This small outline, shrink pitch package offers a nominal supply voltage of 2.1V and a wide temperature range from -40 to 85°C. With dual terminals and a sleek rectangular design, this NMOS technology-based IC provides exceptional performance and versatility. Trust Texas Instruments to bring value, benefits, and advantages to your projects with the SN74TVC3010DBQ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the IC, ensuring a longer lifespan.

Surface Mount: YES

With surface mount capability, this IC can be easily integrated into circuit boards, making the assembly process more efficient.

Package Shape: RECTANGULAR

The rectangular shape allows for easier placement and alignment on circuit boards, ensuring proper connectivity.

Nominal Supply Voltage / Vsup (V): 2.1

The nominal supply voltage of 2.1V is within the typical range for many applications, making this IC versatile and compatible with various systems.

No. of Terminals: 24

Having 24 terminals provides ample connection points for interfacing with other components, allowing for complex circuit designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows this IC to function reliably in industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the IC can also operate in cold environments without performance issues.

Technology: NMOS

NMOS technology offers high speed and low power consumption, making this IC suitable for applications requiring efficient performance.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering onto circuit boards, improving the overall reliability of the connection.

Maximum Supply Voltage (Vsup): 5V

With a maximum supply voltage of 5V, this IC can handle higher power requirements, making it suitable for a wide range of applications.

Technical Specifications

Other Function Logic ICs SN74TVC3010DBQ attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

74

JESD-30 Code:

R-PDSO-G24

Length:

8.65 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

.6 V

Nominal Supply Voltage / Vsup (V):

2.1

Surface Mount:

YES

Technology:

NMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

SN74TVC3010DBQ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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