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NL7SZ58MU3TCG

Onsemi

NL7SZ58MU3TCG by Onsemi

NL7SZ58MU3TCG by Onsemi is a CMOS logic IC with 6 terminals, operating b/w -55 to 125 °C. It has a supply voltage range of 1.65V to 5.5V and comes in a small outline, thin profile package suitable for military-grade applications. This surface-mount device features a square package shape and terminal pitch of 0.35mm, making it ideal for compact electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,990 parts In-Stock

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1,990

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Digiode

USA . 1,356 parts In-Stock

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1,356

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 7,678 parts In-Stock

1+ parts

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7,678

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SupplyDigital Components

Austria . 5,899 parts In-Stock

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5,899

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TANS Electronics

Latvia . 2,114 parts In-Stock

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2,114

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Problanco Electronics

Mexico . 1,461 parts In-Stock

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1,461

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Corphita

USA . 1,188 parts In-Stock

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1,188

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UHIMA Technologies

Türkiye . 878 parts In-Stock

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878

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Corohmni

South Africa . 394 parts In-Stock

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394

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Overview

Enhance your electronic projects with the NL7SZ58MU3TCG by Onsemi! Crafted with precision and reliability in mind, this high-quality Other Function Logic IC boasts a wide range of applications and benefits. From its durable package body material to its advanced technology, this product offers exceptional value and performance. Whether you're a seasoned professional or an enthusiastic DIYer, the NL7SZ58MU3TCG is sure to elevate your projects to new heights. Upgrade your creations today with this top-notch offering from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Ideal voltage for compatibility with a wide range of electronic devices and systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in a variety of environmental conditions.

Minimum Operating Temperature: -55 °C

Capable of operating in extremely low temperatures, ensuring reliability in harsh environments.

Technology: CMOS

Utilizes low power consumption and produces little heat, making it energy-efficient and reliable for long-term use.

Technical Specifications

Other Function Logic ICs NL7SZ58MU3TCG attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

S-PDSO-N6

Length:

1 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Packing Method:

TR

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NL7SZ58MU3TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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