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SN74AUP1G98DCKTE4

Texas Instruments

SN74AUP1G98DCKTE4 by Texas Instruments

SN74AUP1G98DCKTE4 by Texas Instruments is a CMOS logic IC with 26.8ns propagation delay, 30pF load capacitance, and 1.7A max I (ol). It is used in industrial applications requiring a 3-STATE output with a supply voltage range of 0.8V to 3.6V for compact designs needing small outline packaging.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,912 parts In-Stock

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Digiode

USA . 2,797 parts In-Stock

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2,797

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Distributors (Availability)

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AZTECH Wire

Italy . 233 parts In-Stock

1+ parts

$6.186

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233

$6.186

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Parana Technologies

USA . 145 parts In-Stock

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$23.975

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$24.628

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145

$23.975

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$24.628

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DigiPath Technology Company

USA . 44 parts In-Stock

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$26.399

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$24.287

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44

$26.399

$24.287

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IDEA Electronic Components Group

UK . 1,730 parts In-Stock

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$26.938

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$25.591

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$24.244

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1,730

$26.938

$25.591

$24.244

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ChromeModa Solutions

Germany . 1,478 parts In-Stock

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$26.938

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$22.089

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1,478

$26.938

$22.089

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One Stop Electronics

USA . 1,293 parts In-Stock

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$32.000

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$32.000

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Corphita

USA . 3,511 parts In-Stock

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Overview

Discover the innovative SN74AUP1G98DCKTE4 by Texas Instruments, a cutting-edge Other Function Logic IC that delivers high-quality performance and reliability. With Texas Instruments' renowned reputation for excellence, this product offers unparalleled value and benefits for a wide range of applications. From industrial settings to consumer electronics, this IC provides fast propagation delay, low power consumption, and versatile 3-state output characteristics. Experience the superior quality and efficiency of Texas Instruments with the SN74AUP1G98DCKTE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 26.8 ns

Fast propagation delay allows for quick signal processing, making this IC suitable for high-speed applications.

Surface Mount: YES

Surface mount capability makes it easier to integrate this IC onto circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 1.2

Operates at a low supply voltage, making it energy-efficient and suitable for low-power applications.

Load Capacitance (CL): 30 pF

Low load capacitance helps minimize signal distortion and ensures accurate signal transmission.

Power Supplies (V): 1.2/3.3

Supports multiple power supply voltages, allowing flexibility in different circuit configurations.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, providing flexibility in bus architectures and reducing signal conflicts.

Schmitt Trigger: YES

Schmitt trigger input ensures signal integrity by providing hysteresis, making the IC more reliable in noisy environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this IC suitable for battery-operated devices.

Technical Specifications

Other Function Logic ICs SN74AUP1G98DCKTE4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

26.8 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

SN74AUP1G98DCKTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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