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SN74LS396DR

Texas Instruments

SN74LS396DR by Texas Instruments

SN74LS396DR by Texas Instruments is a TTL logic IC with 16 terminals, operating b/w 0-70°C. It has a supply voltage range of 4.75-5.25V and comes in a small outline rectangular package suitable for surface mounting applications. This IC is commonly used in various electronic devices requiring reliable logic functions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,767 parts In-Stock

1+ parts

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7,767

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Digiode

USA . 4,104 parts In-Stock

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4,104

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Distributors (Availability)

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AZTECH Wire

Italy . 286 parts In-Stock

1+ parts

$18.730

100+ parts

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286

$18.730

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Parana Technologies

USA . 1,927 parts In-Stock

1+ parts

$26.706

100+ parts

-

1k+ parts

$27.621

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1,927

$26.706

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$27.621

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ChromeModa Solutions

Germany . 6,899 parts In-Stock

1+ parts

$30.007

100+ parts

$24.606

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6,899

$30.007

$24.606

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IDEA Electronic Components Group

UK . 930 parts In-Stock

1+ parts

$30.007

100+ parts

$28.507

1k+ parts

$27.006

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930

$30.007

$28.507

$27.006

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One Stop Electronics

USA . 420 parts In-Stock

1+ parts

$58.000

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420

$58.000

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Corphita

USA . 4,017 parts In-Stock

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4,017

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DigiPath Technology Company

USA . 400 parts In-Stock

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$27.054

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400

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$27.054

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Overview

Enhance your electronic projects with the high-quality SN74LS396DR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers reliable and innovative solutions to meet your needs. This versatile Other Function Logic IC is perfect for a wide range of applications, offering great value and benefits to customers. With its small outline package style and commercial-grade temperature tolerance, this product provides exceptional performance and durability. Upgrade your projects today with the SN74LS396DR and experience the quality and reliability that Texas Instruments is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the IC, making it suitable for various operating conditions.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

The rectangular shape enhances compatibility and allows for easy integration into existing circuit designs.

Nominal Supply Voltage / Vsup (V): 5

A standardized voltage supply of 5V simplifies the design process and ensures compatibility with a wide range of systems.

No. of Terminals: 16

Sufficient number of terminals allow for multiple connections, providing versatility and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and is suitable for compact electronic devices.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this IC can withstand a variety of environmental conditions and ensure reliability in operation.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the IC can function in cold environments without any issues.

Terminal Position: DUAL

Dual terminal positions provide flexibility in circuit layout and allow for efficient routing of connections.

Maximum Seated Height: 1.75 mm

The low seated height allows for compact placement within the device, ideal for space-constrained applications.

Width: 3.9 mm

The narrow width of the IC enables it to be used in tight spaces or alongside other components on the PCB.

Minimum Supply Voltage (Vsup): 4.75 V

The low minimum supply voltage ensures proper functionality even in cases of slight voltage fluctuations.

Length: 9.9 mm

The moderate length of the IC allows for easy integration into standard circuit layouts without compromising on space.

Temperature Grade: COMMERCIAL

Designed for commercial use, this IC meets industry standards and is suitable for a wide range of applications in commercial electronics.

Technology: TTL

Utilizing TTL technology ensures compatibility with TTL logic levels and facilitates easy integration into existing TTL-based systems.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering onto the PCB, ensuring secure connections and reliable performance.

Terminal Pitch: 1.27 mm

The moderate terminal pitch enables precise and secure connections, enhancing the overall reliability of the IC in the circuit.

Maximum Supply Voltage (Vsup): 5.25 V

The slightly higher maximum supply voltage provides a safe operating range and allows for compatibility with systems that may have slight voltage variations.

Technical Specifications

Other Function Logic ICs SN74LS396DR attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74LS396DR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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