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NLX1G98MUTCG

Onsemi

NLX1G98MUTCG by Onsemi

NLX1G98MUTCG by Onsemi is a CMOS Schmitt Trigger IC with 6.3ns propagation delay at 5V, suitable for military applications. It operates b/w -55 to 125 °C, has a load capacitance of 50pF, and can handle a max I (ol) of 24A. This surface-mount device comes in a small outline package with dual terminals and is ideal for high-speed signal processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

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1k+

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Digiode

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TANS Electronics

Latvia . 8,354 parts In-Stock

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SupplyDigital Components

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Problanco Electronics

Mexico . 2,167 parts In-Stock

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Corphita

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 563 parts In-Stock

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Corohmni

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Overview

Discover endless possibilities with the NLX1G98MUTCG by Onsemi. Crafted with precision and expertise, this innovative Other Function Logic IC offers unparalleled performance and reliability. From military-grade applications to consumer electronics, this versatile product is designed to exceed expectations. Embrace the future of technology with Onsemi and unlock a world of opportunities with the NLX1G98MUTCG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and insulation for the integrated circuit, making it suitable for a variety of environments.

Propagation Delay At Nominal Supply: 6.3 ns

Low propagation delay ensures fast signal processing, making the product efficient for time-sensitive applications.

Surface Mount: YES

Facilitates easy and secure installation on circuit boards, saving time during assembly.

Nominal Supply Voltage / Vsup (V): 5

Complies with standard supply voltage requirements, ensuring compatibility with a wide range of systems.

Load Capacitance (CL): 50 pF

Suitable for driving moderate capacitive loads, making it versatile for different circuit configurations.

Power Supplies (V): 3.3

Offers flexibility in power supply options, allowing for efficient use in various applications.

No. of Terminals: 6

Provides ample connectivity options for interfacing with other components in a circuit.

Maximum I (ol): 24 Amp

High output current capability allows for driving larger loads, expanding the product's application range.

Maximum Operating Temperature: 125 °C

Can operate at high temperatures without compromising performance, making it suitable for harsh environments.

Minimum Operating Temperature: -55 °C

Can withstand low temperatures, ensuring reliable operation in cold conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing the product's efficiency.

Temperature Grade: MILITARY

Built to withstand rigorous military standards, ensuring reliability in demanding applications.

Technical Specifications

Other Function Logic ICs NLX1G98MUTCG attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

1G

JESD-30 Code:

R-PDSO-N6

Length:

1.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.55 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX1G98MUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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