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SN55327W

Texas Instruments

SN55327W by Texas Instruments

Texas Instruments SN55327W is a MILITARY-grade TTL logic IC with 16 terminals in a RECTANGULAR FLATPACK package. Operating temperature range from -55°C to 125°C, suitable for rugged environments. Ideal for applications requiring high reliability and performance in harsh conditions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,644 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,644

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-

-

-

Vyrian

USA . 2,052 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,052

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,667 parts In-Stock

1+ parts

$7.137

100+ parts

$662.770

1k+ parts

$6.423

10k+ parts

-

1,667

$7.137

$662.770

$6.423

-

DigiPath Technology Company

USA . 1,023 parts In-Stock

1+ parts

$7.859

100+ parts

-

1k+ parts

-

10k+ parts

-

1,023

$7.859

-

-

-

ChromeModa Solutions

Germany . 2,849 parts In-Stock

1+ parts

$8.019

100+ parts

$6.576

1k+ parts

-

10k+ parts

-

2,849

$8.019

$6.576

-

-

IDEA Electronic Components Group

UK . 2,099 parts In-Stock

1+ parts

$8.019

100+ parts

-

1k+ parts

$7.217

10k+ parts

-

2,099

$8.019

-

$7.217

-

AZTECH Wire

Italy . 327 parts In-Stock

1+ parts

$9.057

100+ parts

-

1k+ parts

-

10k+ parts

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327

$9.057

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One Stop Electronics

USA . 1,577 parts In-Stock

1+ parts

$55.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,577

$55.000

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-

-

Corphita

USA . 729 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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729

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Overview

Unlock the potential of your electronic projects with the SN55327W by Texas Instruments. Known for their high-quality products, Texas Instruments delivers cutting-edge solutions in the field of Other Function Logic ICs. This versatile IC offers unmatched reliability and performance, making it ideal for a wide range of applications. From military-grade equipment to consumer electronics, this product is designed to exceed expectations. Experience the value and benefits that Texas Instruments brings to the table with the SN55327W.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent insulation and protection for the components inside, making this product more durable and reliable.

Surface Mount: YES

Surface mount technology simplifies the assembly process and also saves space on the PCB, making it suitable for compact electronic devices.

Package Shape: RECTANGULAR

Rectangular packages are easy to handle and can be efficiently placed on a PCB, allowing for a more organized and streamlined circuit design.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options for various input and output signals, making this product versatile in its applications.

Package Style (Meter): FLATPACK

Flatpack style packages are space-efficient and easy to mount, making them ideal for applications where size constraints are a concern.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and operate reliably in challenging scenarios.

Minimum Operating Temperature: -55 °C

The wide temperature range allows this product to function in both hot and cold environments, making it suitable for a variety of industrial applications.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit design and connectivity options, enabling easier integration with other components in the system.

Temperature Grade: MILITARY

Military-grade components are known for their high reliability and performance under extreme conditions, making this product a top choice for demanding applications.

Technology: TTL

TTL technology ensures fast response times and low power consumption, making this product efficient and suitable for applications where speed is crucial.

Terminal Form: FLAT

Flat terminal forms are easy to solder and ensure a reliable electrical connection, contributing to the overall durability and performance of the product.

Terminal Pitch: 1.27 mm

With a small terminal pitch, this product allows for high-density mounting on a PCB, making it ideal for applications that require a compact design.

Technical Specifications

Other Function Logic ICs SN55327W attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN55327W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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