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74LVC1G58GS,132

NXP Semiconductors

74LVC1G58GS,132 by NXP Semiconductors

NXP Semiconductors' 74LVC1G58GS,132 is a CMOS logic IC with 7.9ns propagation delay and 50pF load capacitance. Ideal for automotive applications, it operates at -40 to 125°C with a supply voltage range of 1.65-5.5V, featuring Schmitt Trigger technology for precise signal processing.

Median Price

$0.199

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 45,000 parts In-Stock

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$0.330

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$0.330

Rochester

USA . 29,350 parts In-Stock

1+ parts

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$0.199

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$0.166

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$0.148

29,350

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$0.199

$0.166

$0.148

Verical

USA . 29,350 parts In-Stock

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$0.184

29,350

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$0.184

EBV Elektronik

Germany . 5,000 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 3,585 parts In-Stock

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$0.071

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$0.071

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Nova Conductors

Japan . 600 parts In-Stock

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$0.112

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DigiKey Marketplace

USA . 75,000 parts In-Stock

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Chip Stock

USA . 51,000 parts In-Stock

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IBS Electronics

USA . 45,000 parts In-Stock

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$0.463

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$0.463

NAC Semi

USA . 35,000 parts In-Stock

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$0.660

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$0.660

Vyrian

USA . 7,930 parts In-Stock

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Anansix

USA . 1,054 parts In-Stock

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VNN

France . 900 parts In-Stock

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Ampacity Inc.

Singapore . 43,608 parts In-Stock

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$0.064

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Corphita

USA . 4,427 parts In-Stock

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$0.068

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$0.068

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AZTECH Wire

Italy . 4,637 parts In-Stock

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$0.090

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Continental Prestige Electronics

USA . 6,541 parts In-Stock

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$0.112

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$0.110

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Argo Parts USA

USA . 3,170 parts In-Stock

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$0.112

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$0.109

3,170

$0.112

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Netroflash

USA . 1,000 parts In-Stock

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$0.112

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$0.110

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Microchip USA

USA . 4,888 parts In-Stock

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$0.747

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$0.747

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Corohmni

South Africa . 234 parts In-Stock

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$15.800

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Aztec Data Supply Inc.

USA . 4,559 parts In-Stock

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$22.809

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UNI Independent Distributors

Spain . 6,976 parts In-Stock

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Eastek

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Supply Digital

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Overview

Discover the cutting-edge 74LVC1G58GS,132 by NXP Semiconductors, a high-quality Other Function Logic IC designed for various applications. With NXP's renowned reputation for excellence, this product offers customers unmatched value and benefits. From its fast propagation delay to its wide temperature range, this IC delivers reliability and performance. Whether used in automotive or industrial settings, the 74LVC1G58GS,132 ensures optimal functionality. Upgrade your projects with this top-tier component and experience superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Propagation Delay At Nominal Supply: 7.9 ns

Low propagation delay ensures fast processing and response time.

Surface Mount: YES

Surface mount technology enables easy and efficient installation on PCBs.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low nominal supply voltage, providing energy efficiency.

Load Capacitance (CL): 50 pF

Suitable for handling a moderate load capacitance for various applications.

Power Supplies (V): 3.3

Supports a standard power supply voltage for compatibility with existing systems.

No. of Terminals: 6

Provides sufficient terminals for connectivity and integration within the circuit.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for dense circuit designs.

Maximum I (ol): 24 Amp

High maximum output current capability for driving loads efficiently.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows for reliable performance in various environments.

Minimum Operating Temperature: -40 °C

Can operate effectively in low-temperature conditions without any issues.

Terminal Finish: TIN

Tin terminal finish offers good conductivity and corrosion resistance.

Package Shape: SQUARE

Square shape package facilitates easy mounting and alignment on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for sufficient time during assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature capacity for reliable soldering during manufacturing.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for ruggedness and reliability.

Schmitt Trigger: YES

Incorporation of Schmitt trigger ensures stable and noise-immune signal processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: NO LEAD

Lead-free terminal form for environmentally friendly and RoHS-compliant operations.

Packing Method: TR

TR packing method provides convenient tape and reel packaging for automated assembly.

Terminal Pitch: 0.3 mm

Fine terminal pitch allows for compact design and high-density mounting on the PCB.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a wide maximum supply voltage range for versatile applications.

Technical Specifications

Other Function Logic ICs 74LVC1G58GS,132 attributes and parameters. Explore more Other Function Logic ICs devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Length:

1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.9 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.35 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.3 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

74LVC1G58GS,132 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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