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SN55326W

Texas Instruments

SN55326W by Texas Instruments

The Texas Instruments SN55326W is a TTL technology logic IC with 16 terminals in a ceramic flatpack package. It operates b/w -55°C to 125°C, making it suitable for military-grade applications. With surface mount capability and rectangular shape, it offers versatile functionality in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,691 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,691

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Digiode

USA . 1,723 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,723

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 309 parts In-Stock

1+ parts

$13.459

100+ parts

-

1k+ parts

-

10k+ parts

-

309

$13.459

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Parana Technologies

USA . 2,017 parts In-Stock

1+ parts

$14.009

100+ parts

-

1k+ parts

$14.480

10k+ parts

-

2,017

$14.009

-

$14.480

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DigiPath Technology Company

USA . 2,190 parts In-Stock

1+ parts

$15.426

100+ parts

$14.192

1k+ parts

-

10k+ parts

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2,190

$15.426

$14.192

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ChromeModa Solutions

Germany . 3,776 parts In-Stock

1+ parts

$15.741

100+ parts

$12.908

1k+ parts

-

10k+ parts

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3,776

$15.741

$12.908

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IDEA Electronic Components Group

UK . 1,228 parts In-Stock

1+ parts

$15.741

100+ parts

$14.954

1k+ parts

$14.167

10k+ parts

-

1,228

$15.741

$14.954

$14.167

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One Stop Electronics

USA . 689 parts In-Stock

1+ parts

$32.000

100+ parts

-

1k+ parts

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10k+ parts

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689

$32.000

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Corphita

USA . 2,668 parts In-Stock

1+ parts

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2,668

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Overview

Unleash the power of cutting-edge technology with the SN55326W by Texas Instruments. Crafted with precision and expertise, this innovative logic IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this versatile product is designed to meet the demands of even the most rigorous environments. Experience the value and benefits of Texas Instruments' dedication to excellence with the SN55326W, providing customers with unmatched performance and efficiency. Elevate your projects to new heights with this top-of-the-line solution.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packaging offers improved thermal performance and durability, making it suitable for harsh operating environments.

Surface Mount: YES

Surface mount technology allows for easier assembly and better signal integrity, making the product more reliable.

Package Shape: RECTANGULAR

Rectangular shape provides efficient use of space and allows for easy integration into electronic circuits.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity options and compatibility with various circuit designs.

Package Style (Meter): FLATPACK

Flatpack style offers a compact form factor and ensures efficient heat dissipation, enhancing overall performance.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand rigorous thermal conditions.

Minimum Operating Temperature: -55 °C

Having a low minimum operating temperature ensures reliable performance in cold environments.

Terminal Position: DUAL

Dual terminal position allows for better connectivity and increased flexibility in circuit design.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure high reliability and durability in extreme conditions.

Technology: TTL

TTL technology offers high-speed operation and compatibility with a wide range of digital systems.

Terminal Form: FLAT

Flat terminal form simplifies soldering and connection processes, making installation easier and more efficient.

Terminal Pitch: 1.27 mm

With a small terminal pitch, the product allows for high-density mounting and compact circuit designs.

Technical Specifications

Other Function Logic ICs SN55326W attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN55326W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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