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MC14490FL2

Onsemi

MC14490FL2 by Onsemi

MC14490FL2 by Onsemi is a CMOS logic IC with 16 terminals in a small outline package. Operating temp range -55 to 125 °C, power supplies of 5/15V. Ideal for military applications requiring surface mount technology and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,382 parts In-Stock

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Digiode

USA . 2,110 parts In-Stock

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2,110

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Kulean Microsystems

USA . 7,755 parts In-Stock

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SupplyDigital Components

Austria . 5,290 parts In-Stock

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TANS Electronics

Latvia . 4,326 parts In-Stock

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Problanco Electronics

Mexico . 2,680 parts In-Stock

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Corphita

USA . 1,978 parts In-Stock

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Corohmni

South Africa . 455 parts In-Stock

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UHIMA Technologies

Türkiye . 381 parts In-Stock

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Overview

Experience the next level of performance with the MC14490FL2 by Onsemi, a cutting-edge Other Function Logic IC that offers unparalleled quality and reliability. Manufactured by industry leader Onsemi, this product is designed to exceed expectations in a variety of applications. With its advanced technology and military-grade temperature grade, this IC ensures optimal functionality even in the most demanding environments. Unlock a world of possibilities and enjoy seamless operation with the MC14490FL2 - the ultimate solution for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the product lightweight and durable, ensuring long-lasting performance.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards without the need for additional mounting hardware.

Package Shape: RECTANGULAR

Rectangular shape makes the product compact and space-efficient, ideal for applications with limited space.

Power Supplies (V): 5/15

Support for multiple power supply voltages (5V and 15V) enhances compatibility with a wide range of systems and applications.

No. of Terminals: 16

High number of terminals provides flexibility for connecting to various components and peripherals in a circuit.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board, making it suitable for compact designs.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows the product to operate effectively in cold environments without compromising functionality.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability, ensuring secure and reliable connections during installation.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit layout and connectivity options for different applications.

Temperature Grade: MILITARY

Military-grade temperature grade ensures robust performance and reliability in harsh operating conditions and critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering, ensuring secure connections in the circuit.

Terminal Pitch: 1.27 mm

Fine terminal pitch of 1.27mm enables high-density mounting and efficient use of space on the circuit board.

Technical Specifications

Other Function Logic ICs MC14490FL2 attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

MC14490FL2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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