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MC14490FELG

Onsemi

MC14490FELG by Onsemi

MC14490FELG by Onsemi is a 6-function logic IC with 4 bits, operating at 5V. With a propagation delay of 740ns, it's ideal for military-grade applications requiring true output polarity and a max supply voltage of 18V. The small outline package makes it suitable for compact designs in harsh environments.

Median Price

$3.590

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,166 parts In-Stock

1+ parts

$3.590

100+ parts

$3.520

1k+ parts

$3.450

10k+ parts

-

4,166

$3.590

$3.520

$3.450

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Distributors (In-Stock)

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Digiode

USA . 125 parts In-Stock

1+ parts

$3.410

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125

$3.410

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Vyrian

USA . 8,272 parts In-Stock

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8,272

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Bristol Electronics

USA . 299 parts In-Stock

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299

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Distributors (Availability)

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Benley Electronics

USA . 3 parts In-Stock

1+ parts

$0.750

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3

$0.750

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Corphita

USA . 723 parts In-Stock

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$3.231

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723

$3.231

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Corohmni

South Africa . 136 parts In-Stock

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$3.590

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136

$3.590

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AZTECH Wire

Italy . 99 parts In-Stock

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$13.000

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99

$13.000

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Kulean Microsystems

USA . 3,998 parts In-Stock

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SupplyDigital Components

Austria . 3,047 parts In-Stock

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3,047

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Problanco Electronics

Mexico . 2,221 parts In-Stock

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Perfect Parts

USA . 1,523 parts In-Stock

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1,523

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TANS Electronics

Latvia . 1,344 parts In-Stock

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1,344

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UHIMA Technologies

Türkiye . 817 parts In-Stock

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ChipTracer

USA . 299 parts In-Stock

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299

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Microchip USA

USA . 186 parts In-Stock

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Kepictronics

USA . 83 parts In-Stock

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83

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Overview

Unlock a world of possibilities with the MC14490FELG by Onsemi. This versatile logic IC offers unmatched quality and reliability, thanks to Onsemi's reputation for excellence. Ideal for a wide range of applications, this product provides customers with seamless integration, enhanced performance, and unparalleled value. Experience the benefits of precision engineering and cutting-edge technology with the MC14490FELG - a game-changer in the world of logic ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

No. of Functions: 6

Offers versatility and flexibility for various logic processing tasks.

Propagation Delay (tpd): 740 ns

Low propagation delay ensures efficient signal processing and fast response times.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, making it suitable for a wide range of environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ensuring reliable performance.

Technical Specifications

Other Function Logic ICs MC14490FELG attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Count Direction:

RIGHT

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

4

No. of Functions:

6

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay (tpd):

740 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.275 mm

Minimum fmax:

4.5 MHz

Trade Compliance

MC14490FELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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