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MC14490FR1

Onsemi

MC14490FR1 by Onsemi

MC14490FR1 by Onsemi is a 6-function logic IC with 4 bits, operating at 5V. It has a propagation delay of 740ns and can withstand temperatures from -55 to 125 °C. Ideal for military applications due to its CMOS technology and small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,424 parts In-Stock

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Vyrian

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SupplyDigital Components

Austria . 6,635 parts In-Stock

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Kulean Microsystems

USA . 4,246 parts In-Stock

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Problanco Electronics

Mexico . 2,945 parts In-Stock

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TANS Electronics

Latvia . 1,557 parts In-Stock

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Corphita

USA . 1,147 parts In-Stock

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UHIMA Technologies

Türkiye . 676 parts In-Stock

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Corohmni

South Africa . 496 parts In-Stock

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Perfect Parts

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Kepictronics

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Overview

Unlock endless possibilities with the MC14490FR1 by Onsemi, a top-quality Other Function Logic ICs that offers unmatched performance and reliability. Manufactured by industry leader Onsemi, this product boasts 6 functions, 4 bits, and a wide operating temperature range, making it perfect for a variety of applications. From automotive to industrial, this IC delivers precise and efficient results with a nominal supply voltage of 5V. Experience the superior value and benefits this product provides, whether you're a seasoned professional or a DIY enthusiast looking to enhance your projects. Choose Onsemi for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for a wide range of applications.

Surface Mount: YES

Being surface mountable offers ease of assembly and compact size, making it suitable for modern circuit board designs.

No. of Functions: 6

Having 6 functions in one IC provides versatility and functionality, reducing the need for multiple components.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with many existing systems and components.

Propagation Delay (tpd): 740 ns

The low propagation delay of 740ns ensures fast and efficient signal processing, improving overall system performance.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this IC can withstand harsh environmental conditions and extended usage.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making it suitable for various applications.

Technical Specifications

Other Function Logic ICs MC14490FR1 attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Count Direction:

RIGHT

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

6

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay (tpd):

740 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Minimum fmax:

4.5 MHz

Trade Compliance

MC14490FR1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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