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NBSG86AMNG

Onsemi

NBSG86AMNG by Onsemi

NBSG86AMNG by Onsemi is a fast logic IC with 0.22ns propagation delay at 2.5V, suitable for industrial applications. It operates b/w -40 to 85°C, has 16 terminals in a square package, and supports power supplies of +-2.5/+-3.3V. This surface-mount chip carrier with a very thin profile is ideal for high-speed signal processing needs.

Median Price

$26.959

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 86 parts In-Stock

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$26.959

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Vyrian

USA . 3,694 parts In-Stock

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Digiode

USA . 276 parts In-Stock

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Zilex Electronics Inc.

Canada . 30 parts In-Stock

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Semtec, LLC

USA . 12 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 12 parts In-Stock

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Elcom Components

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Distributors (Availability)

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Benley Electronics

USA . 4 parts In-Stock

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$1.750

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AZTECH Wire

Italy . 429 parts In-Stock

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$6.150

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Netroflash

USA . 50 parts In-Stock

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$26.959

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Ampacity Inc.

Singapore . 1,284 parts In-Stock

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$40.000

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Perfect Parts

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Kulean Microsystems

USA . 4,778 parts In-Stock

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Kepictronics

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TANS Electronics

Latvia . 1,724 parts In-Stock

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Corphita

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SupplyDigital Components

Austria . 371 parts In-Stock

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Problanco Electronics

Mexico . 238 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 201 parts In-Stock

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UHIMA Technologies

Türkiye . 157 parts In-Stock

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Overview

Experience the next level of performance with the NBSG86AMNG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that meet the highest standards. The NBSG86AMNG falls under the category of Other Function Logic ICs, offering a propagation delay of just 0.22 ns. Whether you're working on industrial applications or high-speed data transmission, this product is designed to exceed your expectations. With a nominal supply voltage of 2.5V and a wide operating temperature range, the NBSG86AMNG ensures reliable and efficient operation. Upgrade your projects today with the exceptional value and benefits that this product brings to the table.

Feature Benefit Bullets

Propagation Delay At Nominal Supply

Low propagation delay ensures fast signal processing and high-speed operation.

Surface Mount

Easy to mount on circuit boards for efficient integration.

Package Shape

Square package shape allows for compact and space-saving design.

Nominal Supply Voltage / Vsup (V)

Stable supply voltage of 2.5V ensures reliable performance.

Power Supplies (V)

Supports a wide range of power supplies for flexibility in system design.

No. of Terminals

Sufficient number of terminals for connecting to other components.

Maximum Operating Temperature

Can operate in high-temperature environments without performance degradation.

Minimum Operating Temperature

Can operate in low-temperature environments without issues.

Terminal Finish

Provides excellent terminal finish for reliable connections and durability.

Terminal Position

Quad terminal position allows for stable mounting on circuit boards.

Width

Compact width enables space-efficient PCB layout.

Minimum Supply Voltage (Vsup)

Supports low minimum supply voltage for energy-efficient operation.

Peak Reflow Temperature °C

Can withstand high reflow temperatures during manufacturing processes.

Temperature Grade

Suitable for industrial operating conditions.

Technology

Uses ECL technology for high-speed and low-power operation.

Packing Method

Rail packing method allows for easy handling and storage.

Technical Specifications

Other Function Logic ICs NBSG86AMNG attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

86

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.5/+-3.3

Maximum Power Supply Current (ICC):

39 mA

Propagation Delay At Nominal Supply:

.22 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NBSG86AMNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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