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NBSG86AMN

Onsemi

NBSG86AMN by Onsemi

NBSG86AMN by Onsemi is a high-speed logic IC with a propagation delay of 0.22 ns, suitable for industrial applications. It operates at a nominal voltage of 2.5V and has a max power supply current of 39mA. This surface-mount chip carrier with a square package shape is designed for quick signal processing in various electronic systems.

Median Price

$32.460

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 7,730 parts In-Stock

1+ parts

-

100+ parts

$32.460

1k+ parts

$32.460

10k+ parts

$32.460

7,730

-

$32.460

$32.460

$32.460

Rochester

USA . 2,900 parts In-Stock

1+ parts

-

100+ parts

$28.020

1k+ parts

$25.070

10k+ parts

$23.590

2,900

-

$28.020

$25.070

$23.590

Verical

USA . 170 parts In-Stock

1+ parts

-

100+ parts

$35.025

1k+ parts

$31.337

10k+ parts

$29.488

170

-

$35.025

$31.337

$29.488

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,469 parts In-Stock

1+ parts

$29.650

100+ parts

-

1k+ parts

-

10k+ parts

-

1,469

$29.650

-

-

-

Vyrian

USA . 538 parts In-Stock

1+ parts

$31.210

100+ parts

-

1k+ parts

-

10k+ parts

-

538

$31.210

-

-

-

Chip Stock

USA . 3,229 parts In-Stock

1+ parts

-

100+ parts

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3,229

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-

-

-

Prism Electronics

USA . 4 parts In-Stock

1+ parts

-

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-

1k+ parts

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4

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,280 parts In-Stock

1+ parts

$28.089

100+ parts

-

1k+ parts

-

10k+ parts

-

2,280

$28.089

-

-

-

Corohmni

South Africa . 379 parts In-Stock

1+ parts

$31.210

100+ parts

-

1k+ parts

-

10k+ parts

-

379

$31.210

-

-

-

Component Stockers USA

USA . 229 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

229

$99.990

-

-

-

TANS Electronics

Latvia . 7,611 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,611

-

-

-

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SupplyDigital Components

Austria . 6,369 parts In-Stock

1+ parts

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100+ parts

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6,369

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Kulean Microsystems

USA . 4,638 parts In-Stock

1+ parts

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4,638

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-

-

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Problanco Electronics

Mexico . 2,418 parts In-Stock

1+ parts

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2,418

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-

-

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Microchip USA

USA . 325 parts In-Stock

1+ parts

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100+ parts

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325

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UHIMA Technologies

Türkiye . 164 parts In-Stock

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164

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Perfect Parts

USA . 4 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4

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-

Overview

Unlock the full potential of your electronic projects with the NBSG86AMN by Onsemi. Crafted with precision and expertise, this high-quality logic IC offers unparalleled performance and reliability. Ideal for a wide range of applications, this chip boasts a lightning-fast propagation delay of just 0.22 ns and a nominal supply voltage of 2.5V. With its surface-mount design and compact square shape, the NBSG86AMN is perfect for space-constrained projects. Trust Onsemi's reputation for excellence and experience the value and benefits this product brings to your designs. Elevate your creations with the NBSG86AMN today!

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.22 ns

Low propagation delay ensures fast operation and high performance of the product.

Surface Mount: YES

Surface mount packaging allows for easy integration onto circuit boards, making it convenient for assembly.

Nominal Supply Voltage / Vsup (V): 2.5

Stable supply voltage of 2.5V ensures reliable operation of the product.

Maximum Operating Temperature: 85 °C

Wide operating temperature range of -40 to 85 °C makes it suitable for industrial applications.

Technology: ECL

Implementation using Emitter-Coupled Logic technology ensures high speed and low power consumption.

Technical Specifications

Other Function Logic ICs NBSG86AMN attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

86

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

RAIL

Peak Reflow Temperature (C):

235

Power Supplies (V):

+-2.5/+-3.3

Maximum Power Supply Current (ICC):

39 mA

Propagation Delay At Nominal Supply:

.22 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

NBSG86AMN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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