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SNJ55325J

Texas Instruments

SNJ55325J by Texas Instruments

SNJ55325J by Texas Instruments is a MILITARY-grade BIPOLAR technology IC with 16 terminals, operating b/w -55 to 125 °C. It has power supplies of 5V and 24V, suitable for applications requiring high-temperature resistance and reliability in CERAMIC packages. Ideal for critical functions in aerospace, defense, or industrial sectors.

Median Price

$17.013

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 10 parts In-Stock

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$12.425

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$13.046

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$12.301

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$12.425

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Bristol Electronics

USA . 457 parts In-Stock

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$21.600

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$19.107

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$17.712

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Vyrian

USA . 7,793 parts In-Stock

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Digiode

USA . 4,146 parts In-Stock

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Electronic Expediters

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Odi Ramu Company

Canada . 9 parts In-Stock

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Sunrise Surplus Inc.

USA . 6 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 5 parts In-Stock

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Resion

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Distributors (Availability)

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AZTECH Wire

Italy . 659 parts In-Stock

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$7.180

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$7.180

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Parana Technologies

USA . 1,089 parts In-Stock

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$12.611

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$13.068

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DigiPath Technology Company

USA . 744 parts In-Stock

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$13.887

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ChromeModa Solutions

Germany . 2,009 parts In-Stock

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$11.619

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IDEA Electronic Components Group

UK . 1,026 parts In-Stock

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$13.462

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$12.753

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One Stop Electronics

USA . 1,120 parts In-Stock

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$54.000

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Corphita

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Kepictronics

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Overview

Elevate your electronic designs with the SNJ55325J by Texas Instruments. Known for their exceptional quality and reliability, Texas Instruments delivers cutting-edge solutions in the Other Function Logic ICs category. This versatile component offers customers unparalleled value and benefits, making it ideal for a wide range of applications. Whether you're designing military-grade equipment or consumer electronics, the SNJ55325J provides superior performance and functionality that sets you apart from the competition. Choose Texas Instruments for innovation that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packaging provides excellent durability and heat dissipation, making this product suitable for harsh operating environments.

Screening Level: 38535Q/M;38534H;883B

This product undergoes rigorous screening processes, ensuring high reliability and quality performance.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of board space and easy integration into electronic circuits.

Power Supplies (V): 5,24

Support for multiple power supply voltages allows for flexibility in system design and compatibility with various voltage requirements.

No. of Terminals: 16

A higher number of terminals provide greater connectivity options and functionality in the circuit design.

Terminal Position: DUAL

Dual terminal position enables easy and secure connection to the circuit board, enhancing reliability and stability.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable operation in extreme temperature conditions, making it suitable for aerospace and defense applications.

Technology: BIPOLAR

Bipolar technology offers high speed and precision, making this product ideal for applications requiring fast and accurate logic functions.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure mounting and reliable connections, reducing the risk of disconnection or signal loss.

Technical Specifications

Other Function Logic ICs SNJ55325J attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5,24

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Other Logic ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNJ55325J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-073-7361, 5962010737361, 5962-01-261-6462, 5962012616462

NIIN

010737361, 012616462

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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