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CD4048BM96E4

Texas Instruments

CD4048BM96E4 by Texas Instruments

CD4048BM96E4 by Texas Instruments is a CMOS logic IC with 600ns propagation delay, 16 terminals, and 5V nominal voltage. It is used in military-grade applications requiring 3-STATE output characteristics and operates within -55 to 125°C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,340 parts In-Stock

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Digiode

USA . 2,885 parts In-Stock

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Native Components

USA . 17 parts In-Stock

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$7.255

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AZTECH Wire

Italy . 598 parts In-Stock

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$11.292

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Parana Technologies

USA . 1,118 parts In-Stock

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$11.719

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$12.111

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DigiPath Technology Company

USA . 1,007 parts In-Stock

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IDEA Electronic Components Group

UK . 1,677 parts In-Stock

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$13.167

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$12.509

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$11.850

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ChromeModa Solutions

Germany . 1,675 parts In-Stock

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$13.167

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One Stop Electronics

USA . 814 parts In-Stock

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Northwest PG Solutions

USA . 1,861 parts In-Stock

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Corphita

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Overview

Experience unparalleled performance and reliability with the Texas Instruments CD4048BM96E4. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality in their products, ensuring superior functionality and durability. The CD4048BM96E4 falls under the category of Other Function Logic ICs, perfect for a wide range of applications. From consumer electronics to industrial automation, this product offers unmatched value, benefits, and advantages to customers seeking high-quality solutions for their projects. Trust Texas Instruments to provide you with the best in logic ICs for your next endeavor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the product resistant to damage and ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 600 ns

This low propagation delay ensures fast and efficient signal processing, making the product suitable for applications requiring quick response times.

Surface Mount: YES

Surface mount technology allows for easy installation and reduces the overall size of the product, making it suitable for compact electronic devices.

Nominal Supply Voltage / Vsup (V): 5

The standard supply voltage of 5V ensures compatibility with a wide range of electronic systems and components.

Load Capacitance (CL): 50 pF

The low load capacitance minimizes power consumption and interference, contributing to energy efficiency and reliable operation.

Power Supplies (V): 5/15

The dual power supply options provide flexibility in voltage selection, allowing the product to be used in various electronic systems with different power requirements.

No. of Terminals: 16

The high number of terminals enables easy connectivity and integration with other components, increasing the product's versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and facilitates compact PCB designs, making the product ideal for applications with limited board real estate.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in challenging environmental conditions, enhancing the product's suitability for industrial and automotive applications.

Output Characteristics: 3-STATE

The 3-state output characteristics allow the product to drive a tri-state bus, providing greater flexibility in signal control and data transmission.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures the product remains functional even in extreme cold environments, expanding its usability in diverse operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides corrosion resistance and excellent electrical conductivity, ensuring long-term reliability and stable performance of the product.

Terminal Position: DUAL

The dual terminal position allows for easy installation and PCB layout, simplifying the assembly process and reducing the risk of errors.

Maximum Seated Height: 1.75 mm

The low seated height minimizes the overall profile of the product, making it suitable for slim and compact electronic devices.

Width: 3.9 mm

The narrow width of the product facilitates space-saving designs and allows for efficient use of board real estate, ideal for applications with limited space constraints.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage ensures compatibility with low-power systems and enables energy-efficient operation of the product.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum reflow time specification ensures proper soldering and assembly processes, guaranteeing the reliability and quality of the product during production.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the product can withstand the reflow soldering process without damage, ensuring robustness and stability in manufacturing.

Length: 9.9 mm

The compact length of the product allows for space-efficient placement on PCBs, enabling versatile design options and accommodating various layout requirements.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliable operation in harsh environmental conditions and high-stress applications, making the product suitable for mission-critical tasks.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, enhancing the product's energy efficiency and reliability in demanding electronic systems.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and easy soldering, ensuring secure connections and robust performance in the product's terminals.

Packing Method: TR

The tape and reel packing method enables automated component placement and handling, simplifying the manufacturing process and improving production efficiency.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for compatibility with various PCB designs and facilitates easy connection with other components, enhancing the product's versatility and usability.

Maximum Supply Voltage (Vsup): 18 V

The high maximum supply voltage capability allows the product to be used in applications requiring higher voltage levels, expanding its applicability in diverse electronic systems.

Technical Specifications

Other Function Logic ICs CD4048BM96E4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

600 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD4048BM96E4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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