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NB7L86MMNG

Onsemi

NB7L86MMNG by Onsemi

NB7L86MMNG by Onsemi is a high-speed logic IC with a propagation delay of 0.18 ns, suitable for industrial applications. Operating at a supply voltage of 2.5V, it features 16 terminals in a square package shape, making it ideal for surface mount installations. With ECL technology and a max temperature of 85 °C, this chip carrier is designed for fast and efficient performance in various electronic systems.

Median Price

$31.420

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 622 parts In-Stock

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$31.420

100+ parts

$30.790

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$30.160

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622

$31.420

$30.790

$30.160

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Digiode

USA . 534 parts In-Stock

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$29.849

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534

$29.849

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Vyrian

USA . 7,827 parts In-Stock

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Netsource Technology, Inc.

USA . 321 parts In-Stock

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Flex Direct, LLC

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Bristol Electronics

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AZTECH Wire

Italy . 247 parts In-Stock

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$21.730

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$21.730

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Corphita

USA . 1,601 parts In-Stock

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$28.278

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Corohmni

South Africa . 194 parts In-Stock

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$31.420

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SupplyDigital Components

Austria . 7,906 parts In-Stock

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Problanco Electronics

Mexico . 6,819 parts In-Stock

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Kulean Microsystems

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Perfect Parts

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Authorized Procurement Solutions

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Kepictronics

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TANS Electronics

Latvia . 777 parts In-Stock

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UHIMA Technologies

Türkiye . 477 parts In-Stock

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Microchip USA

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Overview

Elevate your designs with the NB7L86MMNG from Onsemi, a leader in high-performance semiconductor solutions. This versatile logic IC excels in speed and reliability, making it perfect for demanding applications in telecommunications, automotive, and industrial automation. With its ultra-thin profile and robust temperature range, experience superior performance without compromising on quality. Choose Onsemi for innovation that drives your success!

Feature Benefit Bullets

Propagation Delay: 0.18 ns

This ultra-fast propagation delay makes the product ideal for high-speed applications, ensuring minimal signal delay and improved performance in logic circuits.

Surface Mount: YES

The surface mount design allows for compact placement on PCBs, optimizing space and enabling more efficient circuit designs.

Package Shape: SQUARE

The square package shape facilitates easier alignment and space-efficient layout in designs, promoting better thermal management.

Nominal Supply Voltage / Vsup: 2.5 V

A nominal supply voltage of 2.5 V makes this IC suitable for low-power applications, enhancing energy efficiency and extending battery life in portable devices.

Power Supplies: 2.5/3.3 V

The compatibility with multiple power supply voltages provides flexibility in design, allowing integration into a variety of systems.

No. of Terminals: 16

With 16 terminals, the IC offers a good balance between functionality and compactness, allowing for versatile applications without excessive PCB space.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile along with heat sink support ensures effective thermal management while maintaining a compact design, which is critical for high-performance applications.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliability in industrial environments, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this component is designed to function reliably in extreme conditions, ideal for outdoor or rugged applications.

Terminal Finish: NICKEL GOLD PALLADIUM

The nickel-gold palladium terminal finish provides excellent corrosion resistance and ensures reliable electrical connections, enhancing longevity.

Terminal Position: QUAD

The quad terminal position allows for straightforward PCB layout and easy routing, simplifying the design process.

Maximum Seated Height: 1 mm

A maximum seated height of just 1 mm helps maximize component density on the PCB, which is advantageous for tightly packed designs.

Width: 3 mm

The compact width of 3 mm facilitates easy integration into space-constrained applications without compromising performance.

Minimum Supply Voltage (Vsup): 2.375 V

The ability to operate at a minimum supply voltage of 2.375 V further enhances the product's suitability for low-power designs.

Maximum Time At Peak Reflow Temperature: 30 s

The specified reflow time ensures compatibility with automated assembly processes, facilitating efficient production.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C accommodates standard soldering processes, ensuring compatibility with a wide range of manufacturing techniques.

Length: 3 mm

The compact length of 3 mm contributes to its suitability for high-density applications, ensuring efficient use of space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates reliability in harsh conditions, appealing to sectors such as automotive and industrial automation.

Technology: ECL

Using ECL technology enhances speed and performance, making this IC ideal for high-frequency applications where speed is critical.

Terminal Form: NO LEAD

The no-lead configuration allows for better thermal performance and improved electrical characteristics, ideal for high-performance applications.

Packing Method: RAIL

The rail packing method facilitates automated handling and reduces the risk of damage during transport, ensuring product integrity.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for dense board layouts, enhancing the capability of modern PCB designs.

Maximum Supply Voltage (Vsup): 3.465 V

Supporting a maximum supply voltage of 3.465 V allows for versatility in design, enabling the IC to function across a variety of use cases.

Maximum Power Supply Current (ICC): 50 mA

With a maximum power supply current of 50 mA, this IC ensures sufficient drive capability, suitable for demanding applications.

Technical Specifications

Other Function Logic ICs NB7L86MMNG attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

7L

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

.18 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB7L86MMNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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