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CD74HCT297EE4

Texas Instruments

CD74HCT297EE4 by Texas Instruments

CD74HCT297EE4 by Texas Instruments is a CMOS logic IC with 16 terminals, operating b/w -55 to 125°C. It has a supply voltage range of 4.5V to 5.5V and comes in an in-line package style. This component is commonly used in military-grade applications requiring reliable digital signal processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,245 parts In-Stock

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Digiode

USA . 497 parts In-Stock

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497

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 483 parts In-Stock

1+ parts

$0.130

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$0.124

483

$0.130

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$0.124

Northwest PG Solutions

USA . 2,004 parts In-Stock

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$0.142

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$0.126

2,004

$0.142

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$0.126

One Stop Electronics

USA . 794 parts In-Stock

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$6.000

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794

$6.000

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Advanced Electronics

New Zealand . 60 parts In-Stock

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$13.831

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$12.586

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$11.341

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60

$13.831

$12.586

$11.341

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Corohmni

South Africa . 64 parts In-Stock

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$16.874

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64

$16.874

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AZTECH Wire

Italy . 245 parts In-Stock

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$19.124

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$19.124

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Parana Technologies

USA . 477 parts In-Stock

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$27.264

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$33.892

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477

$27.264

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DigiPath Technology Company

USA . 2,125 parts In-Stock

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$30.021

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$27.620

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$30.021

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ChromeModa Solutions

Germany . 6,812 parts In-Stock

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$30.634

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$25.120

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$30.634

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IDEA Electronic Components Group

UK . 455 parts In-Stock

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$30.634

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$29.102

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$27.571

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$30.634

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Corphita

USA . 861 parts In-Stock

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Overview

Unlock the power of innovation with the CD74HCT297EE4 by Texas Instruments. With a reputation for excellence in manufacturing, this product is designed to exceed expectations in the field of Other Function Logic ICs. Offering reliability and high performance, this versatile component opens up a world of possibilities for your projects. From military-grade applications to cutting-edge technology, the CD74HCT297EE4 delivers top-of-the-line quality and value that you can trust. Elevate your designs with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the components inside, ensuring the product's longevity.

Nominal Supply Voltage / Vsup (V): 5

With a stable supply voltage of 5V, this product can reliably operate within its specified parameters.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows this product to function in a wide range of environments without overheating.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in various applications.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54mm allows for easy compatibility and connectivity with other components and circuit boards.

Technical Specifications

Other Function Logic ICs CD74HCT297EE4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

HCT

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

CD74HCT297EE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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