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SN74S124DRE4

Texas Instruments

SN74S124DRE4 by Texas Instruments

SN74S124DRE4 by Texas Instruments is a TTL logic IC with 2 functions, operating at 5V. It comes in a small outline package with dual terminals and Gull Wing form. Suitable for commercial applications, it has an operating temperature range of 0 to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,911 parts In-Stock

1+ parts

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7,911

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Digiode

USA . 2,800 parts In-Stock

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2,800

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 677 parts In-Stock

1+ parts

$18.544

100+ parts

-

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677

$18.544

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Parana Technologies

USA . 1,317 parts In-Stock

1+ parts

$25.044

100+ parts

-

1k+ parts

$25.727

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1,317

$25.044

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$25.727

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DigiPath Technology Company

USA . 2,227 parts In-Stock

1+ parts

$27.576

100+ parts

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2,227

$27.576

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ChromeModa Solutions

Germany . 3,072 parts In-Stock

1+ parts

$28.139

100+ parts

$23.074

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3,072

$28.139

$23.074

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IDEA Electronic Components Group

UK . 2,372 parts In-Stock

1+ parts

$28.139

100+ parts

$26.732

1k+ parts

$25.325

10k+ parts

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2,372

$28.139

$26.732

$25.325

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One Stop Electronics

USA . 811 parts In-Stock

1+ parts

$42.000

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811

$42.000

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Component Stockers USA

USA . 748 parts In-Stock

1+ parts

$99.990

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748

$99.990

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Corphita

USA . 738 parts In-Stock

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738

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Microchip USA

USA . 183 parts In-Stock

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183

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Overview

Elevate your electronic designs with the SN74S124DRE4 by Texas Instruments, a top-tier manufacturer known for its superior quality and reliability. This innovative Other Function Logic IC offers unparalleled performance and functionality, making it ideal for a wide range of applications. With a compact package style and dual terminals, this IC delivers exceptional value, benefits, and advantages to customers looking for cutting-edge technology that meets their specific needs. Experience the difference with Texas Instruments and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, suitable for a variety of applications.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient assembly onto PCBs, saving time and effort.

No. of Functions: 2

Having 2 functions in one IC increases functionality and versatility in circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V ensures compatibility with a wide range of devices and power sources.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space on the PCB, making it ideal for compact electronic designs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC can perform reliably in various environmental conditions.

Technology: TTL

The use of TTL technology ensures high-speed performance and compatibility with other TTL devices.

Technical Specifications

Other Function Logic ICs SN74S124DRE4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

S

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Logic IC Type:

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74S124DRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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