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SNJ54LS297J

Texas Instruments

SNJ54LS297J by Texas Instruments

SNJ54LS297J by Texas Instruments is a TTL technology logic IC with 16 terminals and a supply voltage range of 4.5V to 5.5V. Operating temperature ranges from -55°C to 125°C, making it suitable for military-grade applications requiring high reliability and performance in harsh environments. The package style is in-line rectangular ceramic, ideal for through-hole mounting in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,972 parts In-Stock

1+ parts

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4,972

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Vyrian

USA . 4,204 parts In-Stock

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4,204

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 825 parts In-Stock

1+ parts

$8.397

100+ parts

-

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825

$8.397

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Parana Technologies

USA . 116 parts In-Stock

1+ parts

$30.114

100+ parts

$2,796.545

1k+ parts

$27.103

10k+ parts

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116

$30.114

$2,796.545

$27.103

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DigiPath Technology Company

USA . 2,027 parts In-Stock

1+ parts

$33.159

100+ parts

$30.507

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-

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2,027

$33.159

$30.507

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IDEA Electronic Components Group

UK . 2,368 parts In-Stock

1+ parts

$33.836

100+ parts

$32.144

1k+ parts

$30.452

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-

2,368

$33.836

$32.144

$30.452

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ChromeModa Solutions

Germany . 403 parts In-Stock

1+ parts

$33.836

100+ parts

$27.746

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-

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403

$33.836

$27.746

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One Stop Electronics

USA . 764 parts In-Stock

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$51.000

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764

$51.000

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Corphita

USA . 2,951 parts In-Stock

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2,951

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Overview

Elevate your electronics projects with the SNJ54LS297J by Texas Instruments, a top-quality Other Function Logic IC that offers unmatched reliability and performance. With its MILITARY-grade temperature rating, this IC is designed to excel in extreme conditions. Whether you're working on industrial automation, aerospace applications or consumer electronics, this versatile IC will deliver the precision and efficiency you need. Trust Texas Instruments to provide cutting-edge technology that drives innovation and success in every project. Choose the SNJ54LS297J for unparalleled value and performance.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material combination offers excellent durability and resistance to high temperatures, making the product suitable for a wide range of environments.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on a circuit board, making the product ideal for compact electronic designs.

Nominal Supply Voltage / Vsup: 5V

The 5V nominal supply voltage ensures compatibility with a standard power source, making integration into existing systems easy.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high heat conditions, improving overall reliability.

Technology: TTL

Utilizing TTL technology ensures fast response times and efficient signal processing, making this product a high-performance choice for logic functions.

Technical Specifications

Other Function Logic ICs SNJ54LS297J attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-CDIP-T16

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SNJ54LS297J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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