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SN74LS629J

Texas Instruments

SN74LS629J by Texas Instruments

SN74LS629J by Texas Instruments is a TTL logic IC with 16 terminals, operating b/w 0-70°C. It has a supply voltage range of 4.75-5.25V and comes in an in-line package style. This IC is commonly used in commercial applications requiring other function logic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,888 parts In-Stock

1+ parts

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6,888

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Digiode

USA . 4,043 parts In-Stock

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4,043

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Sinequanon

UK . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 500 parts In-Stock

1+ parts

$17.348

100+ parts

-

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500

$17.348

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Parana Technologies

USA . 1,578 parts In-Stock

1+ parts

$18.838

100+ parts

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1k+ parts

$18.915

10k+ parts

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1,578

$18.838

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$18.915

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DigiPath Technology Company

USA . 516 parts In-Stock

1+ parts

$20.743

100+ parts

$19.083

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-

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516

$20.743

$19.083

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ChromeModa Solutions

Germany . 3,606 parts In-Stock

1+ parts

$21.166

100+ parts

$17.356

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3,606

$21.166

$17.356

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IDEA Electronic Components Group

UK . 607 parts In-Stock

1+ parts

$21.166

100+ parts

$20.108

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$19.049

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607

$21.166

$20.108

$19.049

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One Stop Electronics

USA . 1,104 parts In-Stock

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$26.000

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1,104

$26.000

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Corphita

USA . 1,181 parts In-Stock

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1,181

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Overview

Upgrade your electronic projects with the SN74LS629J by Texas Instruments, a high-quality Other Function Logic IC perfect for various applications. With Texas Instruments renowned reputation for excellence in manufacturing, you can trust in the reliability and performance of this product. Experience the value and benefits of seamless integration, precise functionality, and enhanced efficiency that the SN74LS629J offers. Elevate your designs with this top-tier component today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed packages provide excellent protection for the internal components, ensuring durability and reliability in various environmental conditions.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage allows for compatibility with a wide range of electronic systems and devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures that the product can operate efficiently even in demanding thermal conditions.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making this product suitable for applications requiring high performance.

Terminal Form: THROUGH-HOLE

Through-hole terminals make it easy to securely mount and connect the IC, providing stability and ease of installation.

Technical Specifications

Other Function Logic ICs SN74LS629J attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDIP-T16

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74LS629J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-195-3179, 5962011953179

NIIN

011953179

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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