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SNJ54S124W

Texas Instruments

SNJ54S124W by Texas Instruments

SNJ54S124W by Texas Instruments is a TTL technology logic IC with 2 functions, operating b/w -55 to 125 °C. It has a supply voltage range of 4.5V to 5.5V and comes in a flatpack style package suitable for military applications. The device is MIL-PRF-38535 screened and surface mountable, making it ideal for robust electronic systems.

Median Price

$11.677

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 14 parts In-Stock

1+ parts

$11.677

100+ parts

$12.261

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$11.560

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14

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Digiode

USA . 4,688 parts In-Stock

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Vyrian

USA . 3,314 parts In-Stock

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3,314

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Electronic Expediters

USA . 97 parts In-Stock

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Resion

USA . 9 parts In-Stock

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GSS - Global Semi Support

USA . 5 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 2 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 706 parts In-Stock

1+ parts

$6.794

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706

$6.794

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One Stop Electronics

USA . 435 parts In-Stock

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$19.000

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$19.000

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Parana Technologies

USA . 383 parts In-Stock

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$27.141

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$32.648

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383

$27.141

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DigiPath Technology Company

USA . 620 parts In-Stock

1+ parts

$29.885

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$27.494

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ChromeModa Solutions

Germany . 5,010 parts In-Stock

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$30.495

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$25.006

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5,010

$30.495

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IDEA Electronic Components Group

UK . 1,321 parts In-Stock

1+ parts

$30.495

100+ parts

$28.970

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$27.446

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1,321

$30.495

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Corphita

USA . 3,531 parts In-Stock

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Overview

Unlock the power of precision and reliability with the SNJ54S124W from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and performance. This versatile logic IC is perfect for a wide range of applications, offering superior value and benefits to customers. Experience seamless operation and efficiency like never before with the SNJ54S124W. Elevate your projects with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and protection for the internal components of the IC, making it suitable for rugged environments.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 2

Having multiple functions in a single IC can help optimize space and simplify circuit design.

Nominal Supply Voltage: 5V

Operates at a commonly used voltage level, making it compatible with a wide range of electronic systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, ensuring reliable performance in various operating conditions.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making it suitable for applications requiring high performance.

Technical Specifications

Other Function Logic ICs SNJ54S124W attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

S

JESD-30 Code:

R-CDFP-F16

Length:

10.16 mm

Logic IC Type:

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.73 mm

Trade Compliance

SNJ54S124W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-498-5086, 5962014985086

NIIN

014985086

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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