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SN74LS443JP4

Texas Instruments

SN74LS443JP4 by Texas Instruments

SN74LS443JP4 by Texas Instruments is a TTL logic IC with 20 terminals, operating at 5V. It has a ceramic rectangular package and operates in commercial temperature range of 0-70°C. This IC is commonly used in applications requiring other function logic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,739 parts In-Stock

1+ parts

-

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7,739

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Digiode

USA . 3,804 parts In-Stock

1+ parts

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-

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3,804

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,231 parts In-Stock

1+ parts

$7.186

100+ parts

-

1k+ parts

$7.694

10k+ parts

-

1,231

$7.186

-

$7.694

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DigiPath Technology Company

USA . 357 parts In-Stock

1+ parts

$7.913

100+ parts

-

1k+ parts

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357

$7.913

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IDEA Electronic Components Group

UK . 638 parts In-Stock

1+ parts

$8.074

100+ parts

-

1k+ parts

$7.267

10k+ parts

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638

$8.074

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$7.267

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ChromeModa Solutions

Germany . 490 parts In-Stock

1+ parts

$8.074

100+ parts

$6.621

1k+ parts

-

10k+ parts

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490

$8.074

$6.621

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AZTECH Wire

Italy . 755 parts In-Stock

1+ parts

$18.199

100+ parts

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755

$18.199

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One Stop Electronics

USA . 410 parts In-Stock

1+ parts

$25.000

100+ parts

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410

$25.000

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Corphita

USA . 578 parts In-Stock

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578

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Overview

Unlock the potential of your electronic projects with the SN74LS443JP4 by Texas Instruments. Known for their high-quality manufacturing, Texas Instruments delivers reliable components that meet the demands of various applications. This Other Function Logic IC offers exceptional value with its seamless integration, efficiency, and performance. Perfect for a wide range of projects, this product provides customers with the advantage of superior functionality and dependability, making it a must-have for any electronics enthusiast or professional looking to take their creations to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC

The ceramic package provides excellent thermal conductivity and stability, making it suitable for high temperature environments.

Nominal Supply Voltage / Vsup (V): 5

Having a nominal supply voltage of 5V allows for compatibility with standard power sources, making it easy to integrate into existing systems.

No. of Terminals: 20

With 20 terminals, this logic IC offers flexibility in connectivity and can support various input and output configurations.

Maximum Operating Temperature: 70 °C

The maximum operating temperature of 70°C ensures reliable performance even in demanding operating conditions.

Technology: TTL

Using TTL technology provides fast switching speeds and low power consumption, making it efficient for logic operations.

Technical Specifications

Other Function Logic ICs SN74LS443JP4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Sub-Category:

Other Logic ICs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS443JP4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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