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CD4048BMTG4

Texas Instruments

CD4048BMTG4 by Texas Instruments

CD4048BMTG4 by Texas Instruments is a CMOS logic IC with 16 terminals, operating at -55 to 125 °C. It has a propagation delay of 600 ns at 5V, suitable for military-grade applications due to its 3-STATE output characteristics and small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,917 parts In-Stock

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Digiode

USA . 129 parts In-Stock

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129

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Distributors (Availability)

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Native Components

USA . 680 parts In-Stock

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$0.456

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-

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$0.438

680

$0.456

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$0.438

Northwest PG Solutions

USA . 108 parts In-Stock

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$0.502

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$0.442

108

$0.502

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$0.442

Parana Technologies

USA . 972 parts In-Stock

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$7.135

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$7.648

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972

$7.135

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$7.648

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DigiPath Technology Company

USA . 2,177 parts In-Stock

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$7.857

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$7.228

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2,177

$7.857

$7.228

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ChromeModa Solutions

Germany . 5,481 parts In-Stock

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$8.017

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$6.574

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5,481

$8.017

$6.574

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IDEA Electronic Components Group

UK . 2,309 parts In-Stock

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$8.017

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$7.215

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2,309

$8.017

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$7.215

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AZTECH Wire

Italy . 743 parts In-Stock

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$17.183

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$17.183

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One Stop Electronics

USA . 202 parts In-Stock

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$20.000

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Corphita

USA . 4,739 parts In-Stock

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Overview

Discover the innovative CD4048BMTG4 by Texas Instruments, a premium quality Other Function Logic IC that delivers unmatched performance and reliability. Proudly manufactured by Texas Instruments, this versatile IC is perfect for a wide range of applications. With its state-of-the-art technology and advanced features, this product offers exceptional value to customers seeking high-quality components. Experience the benefits of the CD4048BMTG4 and unlock a world of possibilities in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the internal components of the IC, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 600 ns

A low propagation delay of 600 ns ensures fast signal processing, making this IC suitable for high-speed applications.

Surface Mount: YES

Surface Mount technology allows for easy and efficient PCB assembly, saving space and reducing overall production costs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this IC compatible with standard power sources, offering ease of integration.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this IC can efficiently drive capacitive loads without sacrificing performance.

Temperature Grade: MILITARY

Military-grade temperature rating ensures reliability in harsh environmental conditions, making this IC suitable for rugged applications.

Technical Specifications

Other Function Logic ICs CD4048BMTG4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

600 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD4048BMTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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