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SN54LS327J-00

Texas Instruments

SN54LS327J-00 by Texas Instruments

SN54LS327J-00 by Texas Instruments is a TTL technology IC with 2 functions, operating b/w -55°C to 125°C. It has a supply voltage range of 4.5V to 5.5V and comes in an in-line package style suitable for military-grade applications. The package body material is ceramic, glass-sealed, making it durable for various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,946 parts In-Stock

1+ parts

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6,946

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Digiode

USA . 2,107 parts In-Stock

1+ parts

-

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2,107

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 841 parts In-Stock

1+ parts

$7.980

100+ parts

-

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-

841

$7.980

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Parana Technologies

USA . 936 parts In-Stock

1+ parts

$8.637

100+ parts

-

1k+ parts

$9.306

10k+ parts

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936

$8.637

-

$9.306

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DigiPath Technology Company

USA . 2,039 parts In-Stock

1+ parts

$9.510

100+ parts

$8.749

1k+ parts

-

10k+ parts

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2,039

$9.510

$8.749

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ChromeModa Solutions

Germany . 2,761 parts In-Stock

1+ parts

$9.704

100+ parts

$7.957

1k+ parts

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10k+ parts

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2,761

$9.704

$7.957

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IDEA Electronic Components Group

UK . 274 parts In-Stock

1+ parts

$9.704

100+ parts

$9.219

1k+ parts

$8.734

10k+ parts

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274

$9.704

$9.219

$8.734

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One Stop Electronics

USA . 271 parts In-Stock

1+ parts

$49.000

100+ parts

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271

$49.000

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Corphita

USA . 3,435 parts In-Stock

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3,435

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Overview

Maximize your circuit performance with the SN54LS327J-00 from Texas Instruments. Known for their high-quality products, Texas Instruments offers this versatile logic IC that boasts a range of applications in various industries. With its durable ceramic and glass-sealed package and military-grade temperature rating, this IC ensures reliable operation in harsh environments. Experience the value and benefits of this advanced technology, providing exceptional functionality and efficiency to your designs. Trust Texas Instruments to deliver top-notch solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed material provides excellent protection for the internal components, ensuring durability and long-term reliability.

No. of Functions: 2

Having two functions in one IC allows for increased functionality in a compact design, making it a versatile option for various applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is a common and widely used standard, ensuring compatibility with a wide range of other components and systems.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high temperatures, making it suitable for use in demanding environmental conditions.

Technology: TTL

The TTL technology used in this IC offers high-speed performance and low power consumption, making it ideal for applications that require fast signal processing.

Technical Specifications

Other Function Logic ICs SN54LS327J-00 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDIP-T14

Logic IC Type:

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

SN54LS327J-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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