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SN544S124J-00

Texas Instruments

SN544S124J-00 by Texas Instruments

SN544S124J-00 by Texas Instruments is a TTL logic IC with 2 functions, operating b/w -55°C to 125°C. It has a supply voltage range of 4.5V to 5.5V and comes in an IN-LINE package style suitable for military-grade applications. The package material is CERAMIC, GLASS-SEALED, making it durable for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,684 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,684

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Vyrian

USA . 2,182 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,182

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 554 parts In-Stock

1+ parts

$7.646

100+ parts

-

1k+ parts

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10k+ parts

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554

$7.646

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Parana Technologies

USA . 1,294 parts In-Stock

1+ parts

$10.592

100+ parts

$983.618

1k+ parts

$9.533

10k+ parts

-

1,294

$10.592

$983.618

$9.533

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DigiPath Technology Company

USA . 84 parts In-Stock

1+ parts

$11.663

100+ parts

$10.730

1k+ parts

-

10k+ parts

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84

$11.663

$10.730

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ChromeModa Solutions

Germany . 6,883 parts In-Stock

1+ parts

$11.901

100+ parts

$9.759

1k+ parts

-

10k+ parts

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6,883

$11.901

$9.759

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IDEA Electronic Components Group

UK . 1,959 parts In-Stock

1+ parts

$11.901

100+ parts

$11.306

1k+ parts

$10.711

10k+ parts

-

1,959

$11.901

$11.306

$10.711

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One Stop Electronics

USA . 999 parts In-Stock

1+ parts

$64.000

100+ parts

-

1k+ parts

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10k+ parts

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999

$64.000

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Corphita

USA . 1,482 parts In-Stock

1+ parts

-

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1,482

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Overview

Upgrade your electronics with the high-quality SN544S124J-00 by Texas Instruments. Known for their reliable products, Texas Instruments delivers top-of-the-line Other Function Logic ICs like this one, offering customers unparalleled performance and durability. With a MILITARY temperature grade and a wide operating temperature range, this IC is perfect for a variety of applications. Trust Texas Instruments to provide you with the innovative solutions you need for your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC

The ceramic package provides excellent thermal conductivity, ensuring efficient heat dissipation and thus improving the overall reliability and lifespan of the product.

No. of Functions: 2

Having two functions in a single IC allows for more functionality to be packed into a smaller space, making this product ideal for applications with limited board space.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is a common standard in many electronic systems, making it easy to integrate this product into existing designs.

Temperature Grade: MILITARY

The military-grade temperature rating ensures that this product can withstand harsh environmental conditions, making it suitable for use in rugged applications.

Technology: TTL

The TTL technology used in this product offers high-speed operation and low power consumption, making it an efficient choice for applications requiring fast signal processing.

Technical Specifications

Other Function Logic ICs SN544S124J-00 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

S

JESD-30 Code:

R-GDIP-T16

Logic IC Type:

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

SN544S124J-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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