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CD74HC297EE4

Texas Instruments

CD74HC297EE4 by Texas Instruments

CD74HC297EE4 by Texas Instruments is a CMOS logic IC with 16 terminals and a propagation delay of 43 ns at 4.5V. It operates in temperatures ranging from -55 to 125°C, making it suitable for military-grade applications requiring fast signal processing within a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,550 parts In-Stock

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Digiode

USA . 1,151 parts In-Stock

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Native Components

USA . 958 parts In-Stock

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$6.000

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958

$6.000

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AZTECH Wire

Italy . 714 parts In-Stock

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$7.268

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$7.268

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Parana Technologies

USA . 1,180 parts In-Stock

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$22.166

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$22.798

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$22.166

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DigiPath Technology Company

USA . 406 parts In-Stock

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$24.408

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406

$24.408

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ChromeModa Solutions

Germany . 5,559 parts In-Stock

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$24.906

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$20.423

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$24.906

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IDEA Electronic Components Group

UK . 42 parts In-Stock

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$24.906

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$23.661

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$22.415

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42

$24.906

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$22.415

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One Stop Electronics

USA . 616 parts In-Stock

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$26.000

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$26.000

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Ampacity Inc.

Singapore . 1,326 parts In-Stock

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$59.000

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Northwest PG Solutions

USA . 1,936 parts In-Stock

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Corphita

USA . 719 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the CD74HC297EE4 by Texas Instruments. This high-quality logic IC offers unmatched performance and reliability, thanks to its innovative design and precision engineering. Ideal for a wide range of applications in various industries, this product ensures seamless operation and maximum efficiency. Experience the value and benefits of superior craftsmanship with Texas Instruments, setting new standards in the field of logic ICs. Choose the CD74HC297EE4 and elevate your projects to new heights of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the IC, making it suitable for various applications.

Propagation Delay At Nominal Supply: 43 ns

Low propagation delay allows for fast processing of signals, making this IC efficient for time-critical applications.

Nominal Supply Voltage / Vsup (V): 4.5

Operates effectively at a moderate supply voltage, providing a good balance between power consumption and performance.

No. of Terminals: 16

Offers multiple connection points for versatile integration into different circuit configurations.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for industrial and military environments where heat resistance is crucial.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing the overall efficiency of the IC.

Technical Specifications

Other Function Logic ICs CD74HC297EE4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

Logic IC Type:

Maximum I (ol):

5.2 Amp

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

43 ns

Propagation Delay (tpd):

43 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

CD74HC297EE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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