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HMC853LC3C0

Analog Devices

HMC853LC3C0 by Analog Devices

Analog Devices' HMC853LC3C0 is a 16-terminal logic IC in a square chip carrier package with ceramic body. Operating temperature range from -40 to 85 °C makes it suitable for industrial applications. Surface mountable, with terminal pitch of 0.5mm, it's ideal for compact electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,573 parts In-Stock

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5,573

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Digiode

USA . 202 parts In-Stock

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202

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Distributors (Availability)

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One Stop Electronics

USA . 320 parts In-Stock

1+ parts

$7.000

100+ parts

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320

$7.000

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AZTECH Wire

Italy . 471 parts In-Stock

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$9.713

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471

$9.713

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Parana Technologies

USA . 1,868 parts In-Stock

1+ parts

$10.997

100+ parts

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$10.227

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1,868

$10.997

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$10.227

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IDEA Electronic Components Group

UK . 870 parts In-Stock

1+ parts

$11.825

100+ parts

$11.234

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$11.234

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870

$11.825

$11.234

$11.234

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DigiPath Technology Company

USA . 1,614 parts In-Stock

1+ parts

$18.447

100+ parts

$17.709

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$17.709

1,614

$18.447

$17.709

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$17.709

Semicontronic

India . 710 parts In-Stock

1+ parts

$37.000

100+ parts

$36.075

1k+ parts

$35.890

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710

$37.000

$36.075

$35.890

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Corphita

USA . 401 parts In-Stock

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401

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Overview

Elevate your designs with the HMC853LC3C0 from Analog Devices, a leading manufacturer known for top-quality products. This Other Function Logic IC offers exceptional performance and reliability in a compact square package, making it perfect for a wide range of applications. With its advanced technology and industrial-grade temperature grade, this chip carrier is a game-changer in the electronics industry. Experience the value and benefits of Analog Devices' innovative solutions with the HMC853LC3C0.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures high durability and reliability, making this product suitable for industrial applications.

Surface Mount: YES

Surface mount capability allows for easy integration into various electronic devices, saving space and simplifying assembly.

Package Shape: SQUARE

The square package shape provides stability and uniformity, aiding in proper placement and soldering during assembly.

No. of Terminals: 16

With 16 terminals, this product offers flexibility in connecting to external components and circuits, enhancing its overall functionality.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C allows this product to operate effectively in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures reliable performance in extreme cold conditions.

Terminal Position: QUAD

The quad terminal positioning provides ease of connection and ensures proper alignment during installation.

Maximum Seated Height: 0.92 mm

The low maximum seated height of 0.92 mm enables space-saving design and efficient integration into compact electronic devices.

Width: 3 mm

The compact width of 3 mm makes this product suitable for applications where space is limited, without compromising on performance.

Length: 3 mm

The small length of 3 mm further enhances the product's versatility in fitting into tight spaces within electronic systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating ensures that this product can withstand harsh operating conditions typically encountered in industrial environments.

Terminal Form: NO LEAD

The terminal form without lead simplifies the installation process and enhances durability for long-lasting performance.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for precise placement and connection, facilitating efficient functionality within electronic circuits.

Technical Specifications

Other Function Logic ICs HMC853LC3C0 attributes and parameters. Explore more Other Function Logic ICs devices from Analog Devices

Specs

Family:

853

JESD-30 Code:

S-CQCC-N16

Length:

3 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.92 mm

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

HMC853LC3C0 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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