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SN74LS396N3

Texas Instruments

SN74LS396N3 by Texas Instruments

SN74LS396N3 by Texas Instruments is a TTL logic IC with 16 terminals, operating b/w 0-70°C. It has a supply voltage range of 4.75-5.25V and comes in an in-line package shape made of plastic/epoxy material. This IC is commonly used in various applications requiring commercial-grade temperature performance and dual terminal positioning.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,663 parts In-Stock

1+ parts

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4,663

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Digiode

USA . 3,740 parts In-Stock

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3,740

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 705 parts In-Stock

1+ parts

$6.133

100+ parts

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705

$6.133

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One Stop Electronics

USA . 671 parts In-Stock

1+ parts

$14.000

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671

$14.000

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Parana Technologies

USA . 908 parts In-Stock

1+ parts

$23.299

100+ parts

-

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$23.941

10k+ parts

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908

$23.299

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$23.941

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DigiPath Technology Company

USA . 1,218 parts In-Stock

1+ parts

$25.655

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1,218

$25.655

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ChromeModa Solutions

Germany . 1,888 parts In-Stock

1+ parts

$26.179

100+ parts

$21.467

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1,888

$26.179

$21.467

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IDEA Electronic Components Group

UK . 341 parts In-Stock

1+ parts

$26.179

100+ parts

$24.870

1k+ parts

$23.561

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341

$26.179

$24.870

$23.561

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Corphita

USA . 3,539 parts In-Stock

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3,539

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Overview

Enhance your electronic projects with the SN74LS396N3 by Texas Instruments, a high-quality Other Function Logic IC that delivers reliable performance. With Texas Instruments' reputation for excellence in manufacturing, you can trust this product to meet your needs. This versatile IC is perfect for a wide range of applications, offering customers value and flexibility. Take advantage of the benefits and advantages this component provides, and elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and resistance to heat, making the product long-lasting.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various circuit designs.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage of 5V ensures compatibility with many electronic systems.

No. of Terminals: 16

Ample number of terminals allow for multiple connections, enhancing functionality.

Package Style (Meter): IN-LINE

In-line package style enables space-saving installation in circuit boards.

Maximum Operating Temperature: 70 °C

High operating temperature range allows for reliable performance in various environments.

Minimum Operating Temperature: 0 °C

Low operating temperature ensures functionality even in colder conditions.

Terminal Position: DUAL

Dual terminal position provides flexibility in connections and secure attachment.

Minimum Supply Voltage (Vsup): 4.75 V

Operating at a minimum supply voltage of 4.75V ensures efficient power usage.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates suitability for standard electronic applications.

Technology: TTL

TTL technology offers high-speed performance and compatibility with TTL logic systems.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for easy soldering and secure connections.

Maximum Supply Voltage (Vsup): 5.25 V

Operating within a maximum supply voltage of 5.25V ensures safe operation without risk of overloading.

Technical Specifications

Other Function Logic ICs SN74LS396N3 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-PDIP-T16

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74LS396N3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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