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SN74AUP1G98YEPR

Texas Instruments

SN74AUP1G98YEPR by Texas Instruments

SN74AUP1G98YEPR by Texas Instruments is a CMOS logic IC with 26.8 ns propagation delay, 30 pF load capacitance, and 1.7 Amp max I (ol). It is ideal for industrial applications requiring a very thin profile and fine pitch package style in a grid array format.

Median Price

$0.583

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$0.583

1k+ parts

$0.484

10k+ parts

$0.431

6,000

-

$0.583

$0.484

$0.431

DigiKey

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.500

10k+ parts

-

6,000

-

-

$0.500

-

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.605

10k+ parts

$0.539

6,000

-

-

$0.605

$0.539

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,367 parts In-Stock

1+ parts

$0.453

100+ parts

-

1k+ parts

-

10k+ parts

-

4,367

$0.453

-

-

-

Vyrian

USA . 4,817 parts In-Stock

1+ parts

$0.477

100+ parts

-

1k+ parts

-

10k+ parts

-

4,817

$0.477

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,682 parts In-Stock

1+ parts

$0.429

100+ parts

-

1k+ parts

-

10k+ parts

-

2,682

$0.429

-

-

-

Parana Technologies

USA . 535 parts In-Stock

1+ parts

$15.724

100+ parts

-

1k+ parts

$16.087

10k+ parts

-

535

$15.724

-

$16.087

-

DigiPath Technology Company

USA . 2,106 parts In-Stock

1+ parts

$17.314

100+ parts

$15.929

1k+ parts

-

10k+ parts

-

2,106

$17.314

$15.929

-

-

IDEA Electronic Components Group

UK . 2,139 parts In-Stock

1+ parts

$17.667

100+ parts

$16.784

1k+ parts

$15.900

10k+ parts

-

2,139

$17.667

$16.784

$15.900

-

ChromeModa Solutions

Germany . 401 parts In-Stock

1+ parts

$17.667

100+ parts

$14.487

1k+ parts

-

10k+ parts

-

401

$17.667

$14.487

-

-

Microchip USA

USA . 440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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440

-

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Overview

Elevate your electronic designs with the SN74AUP1G98YEPR by Texas Instruments, a top-quality Other Function Logic IC that promises reliable performance and versatility. With a reputation for excellence in semiconductor manufacturing, Texas Instruments ensures that this product delivers outstanding results across various applications. From its low propagation delay to its wide operating temperature range, this IC offers unparalleled value and benefits to customers seeking efficiency and precision in their projects. Upgrade your circuits with the SN74AUP1G98YEPR and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a variety of applications.

Propagation Delay At Nominal Supply: 26.8 ns

The low propagation delay ensures fast operation and response times, making this product ideal for high-speed applications.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on PCBs, saving space and enhancing production efficiency.

Nominal Supply Voltage / Vsup (V): 1.2

The low nominal supply voltage of 1.2V results in energy efficiency and can help reduce power consumption in electronic devices.

Load Capacitance (CL): 30 pF

The specified load capacitance ensures stable performance and compatibility with various circuit configurations.

Power Supplies (V): 1.2/3.3

The dual power supply options of 1.2V and 3.3V provide flexibility in system design and compatibility with different voltage requirements.

No. of Terminals: 6

The 6 terminals allow for easy connectivity and integration with other components, making it versatile for different circuit designs.

Maximum I (ol): 1.7 Amp

The high maximum output current of 1.7A enables driving of various loads, making this product suitable for applications requiring higher output power.

Output Characteristics: 3-STATE

The 3-state output feature allows for high impedance state, enhancing flexibility in signal routing and control in the circuit.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it reliable and efficient for digital integrated circuits.

Technical Specifications

Other Function Logic ICs SN74AUP1G98YEPR attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PBGA-B6

Length:

1.4 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA6,2X3,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

26.8 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.5 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.9 mm

Trade Compliance

SN74AUP1G98YEPR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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