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SN74AUP1G98DRLRG4

Texas Instruments

SN74AUP1G98DRLRG4 by Texas Instruments

SN74AUP1G98DRLRG4 by Texas Instruments is a CMOS logic IC with 26.8ns propagation delay at 1.2V, suitable for industrial applications. It features a 3-STATE output, Schmitt Trigger technology, and operates within -40 to 85°C temperature range. This small outline package has 6 terminals and supports surface mount assembly with a terminal pitch of 0.5mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,830 parts In-Stock

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8,830

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Digiode

USA . 913 parts In-Stock

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913

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Distributors (Availability)

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AZTECH Wire

Italy . 282 parts In-Stock

1+ parts

$10.958

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282

$10.958

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Parana Technologies

USA . 1,352 parts In-Stock

1+ parts

$25.482

100+ parts

$2,366.352

1k+ parts

$22.933

10k+ parts

-

1,352

$25.482

$2,366.352

$22.933

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DigiPath Technology Company

USA . 1,072 parts In-Stock

1+ parts

$28.058

100+ parts

$25.814

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1,072

$28.058

$25.814

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ChromeModa Solutions

Germany . 3,525 parts In-Stock

1+ parts

$28.631

100+ parts

$23.477

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3,525

$28.631

$23.477

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IDEA Electronic Components Group

UK . 833 parts In-Stock

1+ parts

$28.631

100+ parts

$27.199

1k+ parts

$25.768

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833

$28.631

$27.199

$25.768

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One Stop Electronics

USA . 785 parts In-Stock

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$52.000

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785

$52.000

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Perfect Parts

USA . 4,452 parts In-Stock

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4,452

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Corphita

USA . 4,176 parts In-Stock

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4,176

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Overview

Discover the ultimate solution for your logic IC needs with the SN74AUP1G98DRLRG4 by Texas Instruments. Crafted with precision and excellence, this product offers unparalleled performance and reliability in a compact package. Ideal for a wide range of applications, this IC boasts a low propagation delay, high output drive capabilities, and versatile power supply options. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Upgrade your projects with the SN74AUP1G98DRLRG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the IC, making it suitable for a wide range of applications.

Propagation Delay At Nominal Supply: 26.8 ns

Fast propagation delay ensures efficient operation of the IC, leading to quick response times in logic applications.

Surface Mount: YES

Ease of installation and compatibility with modern PCB assembly processes.

Nominal Supply Voltage / Vsup (V): 1.2

Operates efficiently at low voltage, saving power and minimizing heat generation.

Load Capacitance (CL): 30 pF

Suitable for driving a moderate load capacitance, ensuring stability in circuit operation.

Power Supplies (V): 1.2/3.3

Supports dual power supplies, offering flexibility in system design.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, useful in bus-driven applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC efficient and reliable.

Maximum Seated Height: 0.6 mm

Low profile design saves space and allows for compact PCB layouts.

Technical Specifications

Other Function Logic ICs SN74AUP1G98DRLRG4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e4

Length:

1.6 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL6,.047,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

26.8 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.6 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.2 mm

Trade Compliance

SN74AUP1G98DRLRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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