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SN74LVC1G98IDCKREP

Texas Instruments

SN74LVC1G98IDCKREP by Texas Instruments

SN74LVC1G98IDCKREP by Texas Instruments is a CMOS logic IC with 6.3ns propagation delay, 32A max I (ol), and 85°C max operating temp. Ideal for industrial applications requiring true output polarity, Schmitt trigger functionality, and a small outline package style.

Median Price

$2.006

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 89,400 parts In-Stock

1+ parts

$1.863

100+ parts

$1.266

1k+ parts

$0.649

10k+ parts

-

89,400

$1.863

$1.266

$0.649

-

Mouser Electronics

USA . 371 parts In-Stock

1+ parts

$2.150

100+ parts

$1.830

1k+ parts

$1.280

10k+ parts

$1.000

371

$2.150

$1.830

$1.280

$1.000

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,964 parts In-Stock

1+ parts

$1.770

100+ parts

-

1k+ parts

-

10k+ parts

-

3,964

$1.770

-

-

-

Vyrian

USA . 2,647 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,647

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,312 parts In-Stock

1+ parts

$1.677

100+ parts

-

1k+ parts

-

10k+ parts

-

4,312

$1.677

-

-

-

Component Stockers USA

USA . 2,297 parts In-Stock

1+ parts

$1.900

100+ parts

$1.370

1k+ parts

$0.930

10k+ parts

-

2,297

$1.900

$1.370

$0.930

-

Parana Technologies

USA . 549 parts In-Stock

1+ parts

$23.209

100+ parts

-

1k+ parts

$23.843

10k+ parts

-

549

$23.209

-

$23.843

-

DigiPath Technology Company

USA . 2,312 parts In-Stock

1+ parts

$25.555

100+ parts

-

1k+ parts

-

10k+ parts

-

2,312

$25.555

-

-

-

ChromeModa Solutions

Germany . 4,595 parts In-Stock

1+ parts

$26.077

100+ parts

$21.383

1k+ parts

-

10k+ parts

-

4,595

$26.077

$21.383

-

-

IDEA Electronic Components Group

UK . 381 parts In-Stock

1+ parts

$26.077

100+ parts

$24.773

1k+ parts

$23.469

10k+ parts

-

381

$26.077

$24.773

$23.469

-

Overview

Elevate your electronics projects with the SN74LVC1G98IDCKREP by Texas Instruments. Known for their superior quality and reliability, Texas Instruments offers a wide range of cutting-edge products in the Other Function Logic ICs category. This versatile logic IC boasts a fast propagation delay, dual terminal position, and 3-STATE output characteristics, making it ideal for a variety of applications. Whether you're designing consumer electronics or industrial machinery, this innovative product delivers exceptional performance and value that will surely exceed your expectations. Trust Texas Instruments to power your next project with excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and cost-effective.

Propagation Delay At Nominal Supply: 6.3 ns

The low propagation delay ensures fast signal processing, making it suitable for applications requiring quick response times.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, especially for automated assembly processes.

Nominal Supply Voltage / Vsup: 1.8 V

The low nominal supply voltage of 1.8V allows for energy-efficient operation, making it suitable for battery-operated devices.

Power Supplies (V): 3.3

The 3.3V power supply capability ensures compatibility with a wide range of electronic systems and components.

No. of Terminals: 6

Having 6 terminals provides flexibility in connecting external components and peripherals, accommodating various system configurations.

Maximum I (ol): 32 Amp

The high maximum output current of 32A enables the device to drive heavy loads without external amplification.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability and stability even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the device to function effectively in cold environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy efficient and reliable.

Technical Specifications

Other Function Logic ICs SN74LVC1G98IDCKREP attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

SN74LVC1G98IDCKREP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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