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CD4048BE

Texas Instruments

CD4048BE by Texas Instruments

CD4048BE by Texas Instruments is a CMOS logic IC with 16 terminals, operating at temperatures from -55 to 125 °C. It has a propagation delay of 600 ns at 5V, outputting up to 6.8 Amps in TRUE polarity. Commonly used in military-grade applications due to its 3-STATE output characteristics and through-hole terminal form.

Median Price

$0.799

Lifecycle Status

Suppliers In-Stock

40

In-Stock Inventory

1k+

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Arrow

USA . 277 parts In-Stock

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Mouser Electronics

USA . 801 parts In-Stock

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DigiKey

USA . 734 parts In-Stock

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$0.633

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Rochester

USA . 106,579 parts In-Stock

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$0.784

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Verical

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Chip1Stop

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Nova Conductors

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Digiode

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TEDSS.com

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Ace Electronics

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DigiKey Marketplace

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LWI Electronics Inc

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Corel Iberica Componentes, S.L.

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Bristol Electronics

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LittleDiode

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Goldney Electronics S.L.

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LIBRA Elektronik GmbH

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Netroflash

USA . 500 parts In-Stock

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Corphita

USA . 3,878 parts In-Stock

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Microchip USA

USA . 238 parts In-Stock

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$9.850

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$9.850

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$9.820

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Parana Technologies

USA . 2,136 parts In-Stock

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$48.568

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DigiPath Technology Company

USA . 689 parts In-Stock

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ChromeModa Solutions

Germany . 5,293 parts In-Stock

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IDEA Electronic Components Group

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A-Z Elektronik GmbH

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Glotronic Ltd.

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Alle Elektronik GmbH

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Supply Digital

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Metaverse IC Inc.

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Assy Fe

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GreenTree Electronics

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Overview

Discover unparalleled quality and reliability with the Texas Instruments CD4048BE. As a leading manufacturer in the industry, Texas Instruments brings you a superior product that exceeds expectations. This versatile logic IC is perfect for a wide range of applications, providing efficient performance and unmatched value. Trust in Texas Instruments to deliver cutting-edge technology that enhances your projects and simplifies your workflow. Elevate your work with the CD4048BE and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good durability and resistance to environmental factors, making this product suitable for various applications.

Propagation Delay At Nominal Supply: 600 ns

Low propagation delay ensures quick response times, making this product ideal for time-sensitive applications.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage supply requirement of 5V makes this product compatible with common power sources.

Maximum Operating Temperature: 125 °C

High operating temperature range allows this product to function reliably in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Other Function Logic ICs CD4048BE attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Additional Features:

CONFIGURABLE AS NOR/OR/NAND/AND/OR-AND/OR-NAND/AND-NOR; EXPANDABLE

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6.8 Amp

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

600 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

5.08 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

CD4048BE Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-178-7745, 5962011787745, 5962-99-745-2888, 5962997452888

NIIN

011787745, 997452888

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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