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SN74LS629N

Texas Instruments

SN74LS629N by Texas Instruments

SN74LS629N by Texas Instruments is a TTL logic IC with 2 functions, 15ns propagation delay, and 5V nominal voltage. It is used in applications requiring fast signal processing and operates within a temperature range of 0-70°C. The package style is in-line with 16 terminals for through-hole mounting.

Median Price

$5.839

Lifecycle Status

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48

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1k+

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RS (Exports)

UK . 58 parts In-Stock

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Mouser Electronics

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Rochester

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DigiKey

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Verical

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Arrow

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Component Electronics Inc.

Canada . 274 parts In-Stock

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$0.870

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American Microsemiconductor Inc.

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Freelance Electronics

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Nova Conductors

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DigiKey Marketplace

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Atlantic Semiconductor

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Standard Data Resources

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Mentor Electronics Marketing, LLC

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Ampacity Inc.

Singapore . 2,834 parts In-Stock

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$3.370

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Semicontronic

India . 2,674 parts In-Stock

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$3.269

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Corphita

USA . 351 parts In-Stock

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Continental Prestige Electronics

USA . 3,904 parts In-Stock

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$3.879

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Argo Parts USA

USA . 536 parts In-Stock

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Netroflash

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$3.681

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Corohmni

South Africa . 909 parts In-Stock

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Parana Technologies

USA . 175 parts In-Stock

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Microchip USA

USA . 5,824 parts In-Stock

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DigiPath Technology Company

USA . 563 parts In-Stock

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ChromeModa Solutions

Germany . 6,448 parts In-Stock

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IDEA Electronic Components Group

UK . 2,058 parts In-Stock

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Lixinc

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Assy Fe

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Infinite Electronics LLP (Excess)

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Kepictronics

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Overview

Unlock the potential of your electronics with the SN74LS629N by Texas Instruments. Designed with precision and reliability in mind, this high-quality logic IC offers unmatched performance for a variety of applications. Whether you're working on a DIY project or a professional circuit design, this product's innovative technology and durable construction ensure seamless operation and long-lasting durability. Experience the value and benefits of Texas Instruments' expertise with the SN74LS629N - where quality meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, ensuring protection for the IC components.

Propagation Delay At Nominal Supply: 15 ns

Low propagation delay ensures fast processing and response times in circuit operations.

No. of Functions: 2

Multiple functions in a single IC provides versatility and efficiency in circuit design.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage for compatibility with many electronic systems.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for use in various environments and conditions.

Technical Specifications

Other Function Logic ICs SN74LS629N attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Maximum Power Supply Current (ICC):

55 mA

Propagation Delay At Nominal Supply:

15 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN74LS629N Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-122-1918, 5962011221918

NIIN

011221918

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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