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SN74LS448FN3

Texas Instruments

SN74LS448FN3 by Texas Instruments

SN74LS448FN3 by Texas Instruments is a TTL logic IC with 20 terminals in a square chip carrier package. It operates at temperatures b/w 0°C to 70°C and has a supply voltage of 5V. This IC is commonly used in commercial applications requiring other function logic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,683 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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4,683

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Digiode

USA . 3,819 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,819

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,575 parts In-Stock

1+ parts

$10.672

100+ parts

$991.056

1k+ parts

$9.605

10k+ parts

-

1,575

$10.672

$991.056

$9.605

-

DigiPath Technology Company

USA . 313 parts In-Stock

1+ parts

$11.751

100+ parts

$10.811

1k+ parts

-

10k+ parts

-

313

$11.751

$10.811

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IDEA Electronic Components Group

UK . 1,981 parts In-Stock

1+ parts

$11.991

100+ parts

$11.391

1k+ parts

$10.792

10k+ parts

-

1,981

$11.991

$11.391

$10.792

-

ChromeModa Solutions

Germany . 442 parts In-Stock

1+ parts

$11.991

100+ parts

$9.833

1k+ parts

-

10k+ parts

-

442

$11.991

$9.833

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AZTECH Wire

Italy . 439 parts In-Stock

1+ parts

$13.485

100+ parts

-

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439

$13.485

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One Stop Electronics

USA . 1,197 parts In-Stock

1+ parts

$49.000

100+ parts

-

1k+ parts

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10k+ parts

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1,197

$49.000

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Corphita

USA . 1,036 parts In-Stock

1+ parts

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100+ parts

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1,036

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Overview

Unlock limitless possibilities with the SN74LS448FN3 by Texas Instruments, a high-quality logic IC designed to take your projects to the next level. Manufactured by industry leader Texas Instruments, this chip offers superior performance and reliability for a wide range of applications. From consumer electronics to industrial automation, this versatile product delivers unmatched value, efficiency, and convenience for all your circuit design needs. Upgrade your projects today with the SN74LS448FN3 and experience the difference Texas Instruments can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the IC durable and reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Package Shape: SQUARE

Square package shape provides efficient use of space on the PCB.

Nominal Supply Voltage / Vsup (V): 5

Operating at a 5V supply voltage makes this product compatible with standard power sources.

Maximum Operating Temperature: 70 °C

The product can operate at a maximum temperature of 70°C, suitable for most operating environments.

Terminal Position: QUAD

Quad terminal position allows for easy connection to other components on the PCB.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption.

Technical Specifications

Other Function Logic ICs SN74LS448FN3 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Sub-Category:

Other Logic ICs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN74LS448FN3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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