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81021012A

Texas Instruments

81021012A by Texas Instruments

The Texas Instruments 81021012A is a TTL technology IC with 2 functions, 15ns propagation delay, and 24A max I (ol). It is used in military-grade applications requiring fast signal processing and operates within -55 to 125 °C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,232 parts In-Stock

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Digiode

USA . 3,574 parts In-Stock

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3,574

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Distributors (Availability)

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Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$12.515

100+ parts

$11.389

1k+ parts

$10.262

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60

$12.515

$11.389

$10.262

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AZTECH Wire

Italy . 768 parts In-Stock

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$13.735

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768

$13.735

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Parana Technologies

USA . 707 parts In-Stock

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$13.823

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$14.308

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707

$13.823

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$14.308

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ChromeModa Solutions

Germany . 3,783 parts In-Stock

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$15.532

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$12.736

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3,783

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$12.736

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IDEA Electronic Components Group

UK . 1,553 parts In-Stock

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$15.532

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$14.755

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$13.979

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$13.979

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Corohmni

South Africa . 231 parts In-Stock

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$22.720

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$22.720

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Ampacity Inc.

Singapore . 1,383 parts In-Stock

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$27.000

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$27.000

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One Stop Electronics

USA . 718 parts In-Stock

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$29.000

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718

$29.000

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Semicontronic

India . 1,486 parts In-Stock

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$51.000

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$49.725

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$49.470

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1,486

$51.000

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$49.470

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Microchip USA

USA . 1,332 parts In-Stock

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Corphita

USA . 1,005 parts In-Stock

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Native Components

USA . 848 parts In-Stock

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DigiPath Technology Company

USA . 754 parts In-Stock

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$14.004

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754

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$14.004

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Northwest PG Solutions

USA . 715 parts In-Stock

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715

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Overview

Discover the unparalleled quality of the 81021012A by Texas Instruments, a cutting-edge Other Function Logic IC that offers exceptional performance and reliability. Manufactured by the renowned brand Texas Instruments, this chip boasts a MIL-STD-883 screening level, ensuring top-notch durability. With a propagation delay of just 15 ns, this IC is perfect for a wide range of applications. Whether you're looking to enhance your electronics projects or streamline your industrial processes, the 81021012A delivers unmatched value and efficiency. Upgrade your systems today with this high-quality chip from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures high durability and reliability, making the product suitable for demanding applications.

Propagation Delay At Nominal Supply: 15 ns

The low propagation delay ensures quick response and high-speed operation, making it ideal for time-sensitive applications.

No. of Functions: 2

Having multiple functions in a single IC can help in simplifying circuit designs and reducing overall system complexity.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V simplifies power management and compatibility with other components.

Maximum Operating Temperature: 125 °C

The high operating temperature range allows the IC to function reliably in various environmental conditions.

Technology: TTL

TTL technology provides fast switching speeds and low power consumption, making it a reliable choice for logic ICs.

Technical Specifications

Other Function Logic ICs 81021012A attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Maximum Power Supply Current (ICC):

55 mA

Propagation Delay At Nominal Supply:

15 ns

Propagation Delay (tpd):

15 ns

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

2.03 mm

Sub-Category:

Logic IC:Other

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

81021012A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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