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CD74ACT297M

Texas Instruments

CD74ACT297M by Texas Instruments

CD74ACT297M by Texas Instruments is a CMOS logic IC with 16 terminals, 30ns propagation delay at 5V. It operates b/w -55 to 125°C and has a peak reflow temp of 260°C. Suitable for military-grade applications requiring fast signal processing in compact spaces.

Median Price

$2.425

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 167 parts In-Stock

1+ parts

$6.040

100+ parts

$3.440

1k+ parts

$2.400

10k+ parts

$2.360

167

$6.040

$3.440

$2.400

$2.360

Rochester

USA . 3,027 parts In-Stock

1+ parts

-

100+ parts

$2.170

1k+ parts

$1.940

10k+ parts

$1.820

3,027

-

$2.170

$1.940

$1.820

DigiKey

USA . 3,027 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.850

10k+ parts

-

3,027

-

-

$2.850

-

Verical

USA . 1,840 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.425

10k+ parts

$2.275

1,840

-

-

$2.425

$2.275

Chip1Stop

Japan . 200 parts In-Stock

1+ parts

-

100+ parts

$1.550

1k+ parts

-

10k+ parts

-

200

-

$1.550

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,877 parts In-Stock

1+ parts

$1.550

100+ parts

-

1k+ parts

-

10k+ parts

-

1,877

$1.550

-

-

-

Digiode

USA . 255 parts In-Stock

1+ parts

$1.976

100+ parts

-

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255

$1.976

-

-

-

DigiKey Marketplace

USA . 3,256 parts In-Stock

1+ parts

-

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-

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3,256

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-

-

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Extreme Components

USA . 19 parts In-Stock

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19

-

-

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LWI Electronics Inc

India . 14 parts In-Stock

1+ parts

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14

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Prism Electronics

USA . 5 parts In-Stock

1+ parts

-

100+ parts

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5

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 962 parts In-Stock

1+ parts

$1.320

100+ parts

-

1k+ parts

-

10k+ parts

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962

$1.320

-

-

-

Component Stockers USA

USA . 4,410 parts In-Stock

1+ parts

$1.840

100+ parts

$1.740

1k+ parts

$1.390

10k+ parts

-

4,410

$1.840

$1.740

$1.390

-

Corphita

USA . 4,152 parts In-Stock

1+ parts

$1.872

100+ parts

-

1k+ parts

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4,152

$1.872

-

-

-

Native Components

USA . 283 parts In-Stock

1+ parts

$6.187

100+ parts

-

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283

$6.187

-

-

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Parana Technologies

USA . 1,203 parts In-Stock

1+ parts

$14.939

100+ parts

-

1k+ parts

$15.361

10k+ parts

-

1,203

$14.939

-

$15.361

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DigiPath Technology Company

USA . 2,196 parts In-Stock

1+ parts

$16.449

100+ parts

-

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2,196

$16.449

-

-

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ChromeModa Solutions

Germany . 4,491 parts In-Stock

1+ parts

$16.785

100+ parts

$13.764

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-

10k+ parts

-

4,491

$16.785

$13.764

-

-

IDEA Electronic Components Group

UK . 15 parts In-Stock

1+ parts

$16.785

100+ parts

$15.946

1k+ parts

$15.106

10k+ parts

-

15

$16.785

$15.946

$15.106

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

-

-

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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-

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Northwest PG Solutions

USA . 1,581 parts In-Stock

1+ parts

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$6.064

10k+ parts

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1,581

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$6.064

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Supply Digital

USA . 557 parts In-Stock

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557

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Perfect Parts

USA . 383 parts In-Stock

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383

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Overview

Experience the superior quality and reliability of Texas Instruments with the CD74ACT297M, a high-performance Other Function Logic IC. With a nominal supply voltage of 5V and a propagation delay of just 30ns, this versatile component is ideal for a wide range of applications. From communication systems to industrial automation, this compact small outline package offers customers exceptional value, efficiency, and dependability. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 30 ns

The low propagation delay ensures fast and efficient signal processing in the circuit.

Surface Mount: YES

The surface mount capability makes installation and soldering of the IC easy and convenient.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage of 5V, making it compatible with many power supplies.

Maximum I (ol): 24 Amp

Can handle high output current, making it suitable for powering various components in the circuit.

Maximum Operating Temperature: 125 °C

Can operate efficiently in high-temperature environments, ensuring reliable performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable.

Technical Specifications

Other Function Logic ICs CD74ACT297M attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

30 ns

Propagation Delay (tpd):

30 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74ACT297M Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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