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SN54LS396J

Texas Instruments

SN54LS396J by Texas Instruments

SN54LS396J by Texas Instruments is a TTL technology IC with 16 terminals, operating b/w -55 to 125 °C. It has a supply voltage range of 4.5V to 5.5V and comes in an in-line package style. This military-grade IC is commonly used in applications requiring other function logic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,230 parts In-Stock

1+ parts

-

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8,230

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Digiode

USA . 4,811 parts In-Stock

1+ parts

-

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-

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4,811

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,106 parts In-Stock

1+ parts

$10.577

100+ parts

-

1k+ parts

$11.077

10k+ parts

-

2,106

$10.577

-

$11.077

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ChromeModa Solutions

Germany . 3,656 parts In-Stock

1+ parts

$11.884

100+ parts

$9.745

1k+ parts

-

10k+ parts

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3,656

$11.884

$9.745

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IDEA Electronic Components Group

UK . 1,749 parts In-Stock

1+ parts

$11.884

100+ parts

$11.290

1k+ parts

$10.696

10k+ parts

-

1,749

$11.884

$11.290

$10.696

-

AZTECH Wire

Italy . 847 parts In-Stock

1+ parts

$18.550

100+ parts

-

1k+ parts

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847

$18.550

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-

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One Stop Electronics

USA . 557 parts In-Stock

1+ parts

$46.000

100+ parts

-

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557

$46.000

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Corphita

USA . 1,408 parts In-Stock

1+ parts

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1,408

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DigiPath Technology Company

USA . 646 parts In-Stock

1+ parts

-

100+ parts

$10.715

1k+ parts

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646

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$10.715

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Assy Fe

Spain . 25 parts In-Stock

1+ parts

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25

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Overview

Elevate your electronic projects with the SN54LS396J from Texas Instruments, a top-tier manufacturer known for quality and reliability. This versatile Other Function Logic IC offers a wide range of applications, providing exceptional value and benefits to customers seeking efficient solutions. With its durable ceramic, metal-sealed cofired package body material and military-grade temperature grade, this product is designed to withstand harsh environments while delivering superior performance. Upgrade your projects today with the SN54LS396J and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures durability and reliability for long-term use.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this product compatible with a wide range of applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high temperature environments without performance degradation.

Minimum Operating Temperature: -55 °C

The ability to operate at temperatures as low as -55°C makes this product suitable for a variety of environments and applications.

Technology: TTL

Based on TTL technology, this product offers reliable performance and compatibility with other TTL-based systems.

Technical Specifications

Other Function Logic ICs SN54LS396J attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-CDIP-T16

Length:

19.56 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN54LS396J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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