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SN74LS629DE4

Texas Instruments

SN74LS629DE4 by Texas Instruments

SN74LS629DE4 by Texas Instruments is a TTL logic IC with 2 functions, operating at 5V. It comes in a small outline package with dual terminals and can withstand temperatures from 0 to 70°C. Ideal for commercial applications requiring reliable logic functions in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,971 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,971

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Digiode

USA . 4,300 parts In-Stock

1+ parts

-

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4,300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 861 parts In-Stock

1+ parts

$7.569

100+ parts

-

1k+ parts

-

10k+ parts

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861

$7.569

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-

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Parana Technologies

USA . 474 parts In-Stock

1+ parts

$20.675

100+ parts

-

1k+ parts

$20.794

10k+ parts

-

474

$20.675

-

$20.794

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ChromeModa Solutions

Germany . 3,181 parts In-Stock

1+ parts

$23.230

100+ parts

$19.049

1k+ parts

-

10k+ parts

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3,181

$23.230

$19.049

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IDEA Electronic Components Group

UK . 174 parts In-Stock

1+ parts

$23.230

100+ parts

$22.068

1k+ parts

$20.907

10k+ parts

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174

$23.230

$22.068

$20.907

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One Stop Electronics

USA . 1,105 parts In-Stock

1+ parts

$38.000

100+ parts

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1,105

$38.000

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Corphita

USA . 3,292 parts In-Stock

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3,292

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DigiPath Technology Company

USA . 384 parts In-Stock

1+ parts

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100+ parts

$20.944

1k+ parts

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384

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$20.944

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Overview

Unlock the power of innovation with the SN74LS629DE4 by Texas Instruments, a top-quality Other Function Logic IC designed to elevate your projects to new heights. With Texas Instruments' reputation for excellence in manufacturing, this product offers unparalleled reliability and performance. Ideal for a wide range of applications, the SN74LS629DE4 delivers value and benefits that cater to the needs of customers looking for efficiency and precision. Upgrade your designs with this versatile solution and experience the advantages it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY is a durable and cost-effective material for packaging, ensuring the product is reliable and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards, saving space and reducing production costs.

No. of Functions: 2

Having two functions in one IC provides versatility and efficiency in circuit design, reducing the need for additional components.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes this product compatible with a wide range of systems and power sources.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this IC can perform reliably in various environmental conditions.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making this product suitable for high-performance applications.

Technical Specifications

Other Function Logic ICs SN74LS629DE4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74LS629DE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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