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NLV7SZ97DFT2G

Onsemi

NLV7SZ97DFT2G by Onsemi

NLV7SZ97DFT2G by Onsemi is a CMOS logic IC with 6.3ns propagation delay, suitable for military applications. It operates at 3.3V power supply, has a load capacitance of 50pF, and features Schmitt Trigger technology. The package is small outline with dual terminals and matte tin finish, making it ideal for high-temp environments.

Median Price

$0.070

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 379 parts In-Stock

1+ parts

$0.370

100+ parts

$0.139

1k+ parts

$0.080

10k+ parts

$0.062

379

$0.370

$0.139

$0.080

$0.062

Verical

USA . 48,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.054

48,000

-

-

-

$0.054

Flip Electronics (Authorized)

USA . 48,000 parts In-Stock

1+ parts

-

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10k+ parts

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48,000

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Rochester

USA . 48,000 parts In-Stock

1+ parts

-

100+ parts

$0.058

1k+ parts

$0.048

10k+ parts

$0.043

48,000

-

$0.058

$0.048

$0.043

Arrow

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.070

10k+ parts

$0.060

12,000

-

-

$0.070

$0.060

Chip1Stop

Japan . 8,800 parts In-Stock

1+ parts

-

100+ parts

$0.098

1k+ parts

$0.074

10k+ parts

$0.053

8,800

-

$0.098

$0.074

$0.053

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 736 parts In-Stock

1+ parts

$0.352

100+ parts

-

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10k+ parts

-

736

$0.352

-

-

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Flip Electronics

USA . 108,000 parts In-Stock

1+ parts

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100+ parts

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108,000

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Vyrian

USA . 2,976 parts In-Stock

1+ parts

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2,976

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Sensible Micro Corp

USA . 2,406 parts In-Stock

1+ parts

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2,406

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 376 parts In-Stock

1+ parts

$0.069

100+ parts

-

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376

$0.069

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Vigor

Singapore . 321 parts In-Stock

1+ parts

$0.140

100+ parts

-

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321

$0.140

-

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Corphita

USA . 1,219 parts In-Stock

1+ parts

$0.333

100+ parts

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1,219

$0.333

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Microchip USA

USA . 3,971 parts In-Stock

1+ parts

$0.473

100+ parts

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3,971

$0.473

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SupplyDigital Components

Austria . 4,957 parts In-Stock

1+ parts

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4,957

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TANS Electronics

Latvia . 3,124 parts In-Stock

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3,124

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Kulean Microsystems

USA . 598 parts In-Stock

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598

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Problanco Electronics

Mexico . 366 parts In-Stock

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366

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UHIMA Technologies

Türkiye . 314 parts In-Stock

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314

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Overview

Experience the power of innovation with the NLV7SZ97DFT2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Other Function Logic ICs that are versatile and reliable. With a wide range of applications, this product offers superior performance and efficiency. Whether you're designing automotive systems or consumer electronics, the NLV7SZ97DFT2G provides exceptional value, benefits, and advantages that will exceed your expectations. Trust Onsemi for all your electronic component needs and elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to external elements, making this product suitable for a wide range of applications.

Propagation Delay At Nominal Supply: 6.3 ns

Low propagation delay ensures fast signal processing, making this product ideal for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Screening Level: AEC-Q101

AEC-Q101 screening level ensures that the product meets stringent automotive industry standards for reliability and performance.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this product compatible with standard voltage requirements in many electronic systems.

Load Capacitance (CL): 50 pF

The low load capacitance of 50pF ensures efficient signal transmission and reception, enhancing the overall performance of the product.

Power Supplies (V): 3.3

Supporting power supplies of 3.3V enables compatibility with a wide range of electronic devices featuring this common voltage requirement.

No. of Terminals: 6

Having 6 terminals provides ample connectivity options for integrating the product into various circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim package style allows for space-saving integration in densely packed electronic assemblies.

Maximum I (ol): 24 Amp

With a high maximum output current of 24A, this product can drive demanding loads with ease, making it versatile for various applications.

Maximum Operating Temperature: 125 °C

Operating reliably at a high temperature of 125 °C ensures stability and performance in harsh environments or under heavy load conditions.

Minimum Operating Temperature: -55 °C

Being able to function at a minimum temperature of -55 °C allows for operation in cold environments without compromising performance.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin terminal finish provides good solderability and conductivity, ensuring secure connections during PCB assembly.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and connection options, facilitating easier integration into different circuit designs.

Maximum Seated Height: 1.1 mm

The low seated height of 1.1mm allows for a compact overall profile of the product, contributing to space-efficient design layouts.

Width: 1.25 mm

The narrow width of 1.25mm enables close placement of components on the PCB, optimizing circuit layout and minimizing space usage.

Minimum Supply Voltage (Vsup): 1.65 V

Supporting a minimum supply voltage of 1.65V ensures compatibility with low-power applications or systems requiring lower operating voltages.

Maximum Time At Peak Reflow Temperature (s): 30

Allowing a maximum reflow time of 30 seconds at peak temperature ensures proper soldering and reliability during PCB assembly processes.

Peak Reflow Temperature °C: 260

Withstanding a peak reflow temperature of 260 °C ensures the product's reliability and integrity during the soldering process.

Length: 2 mm

The compact length of 2mm contributes to the overall space-saving design of the product, making it suitable for compact electronic devices.

Temperature Grade: MILITARY

Being classified as a military-grade component indicates high reliability, resilience, and performance in demanding operating conditions.

Schmitt Trigger: YES

Incorporating a Schmitt trigger feature enhances noise immunity and signal stability, ensuring accurate and reliable signal processing in the product.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital applications.

Terminal Form: GULL WING

The gull-wing terminal form enhances mechanical strength, facilitates easy soldering, and provides secure mounting on the PCB.

Packing Method: TR

The Tape and Reel (TR) packing method enables efficient handling, storage, and automated pick-and-place assembly of the product in mass production.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65mm allows for high-density mounting on the PCB, optimizing space utilization and enabling compact product designs.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum supply voltage of 5.5V allows for compatibility with devices requiring higher voltage levels, expanding the product's application range.

Technical Specifications

Other Function Logic ICs NLV7SZ97DFT2G attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Screening Level:

AEC-Q101

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NLV7SZ97DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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