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SN74AUP1G58DCKRG4

Texas Instruments

SN74AUP1G58DCKRG4 by Texas Instruments

SN74AUP1G58DCKRG4 by Texas Instruments is a CMOS logic IC with 26.6ns propagation delay, 30pF load capacitance, and 1.7A max I (ol). It operates at a supply voltage of 1.2V/3.3V and has an industrial temperature grade. Ideal for applications requiring low power consumption and compact design in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,067 parts In-Stock

1+ parts

-

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3,067

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Digiode

USA . 290 parts In-Stock

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290

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,074 parts In-Stock

1+ parts

$7.909

100+ parts

-

1k+ parts

$8.466

10k+ parts

-

2,074

$7.909

-

$8.466

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DigiPath Technology Company

USA . 1,126 parts In-Stock

1+ parts

$8.708

100+ parts

-

1k+ parts

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1,126

$8.708

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ChromeModa Solutions

Germany . 2,670 parts In-Stock

1+ parts

$8.886

100+ parts

$7.287

1k+ parts

-

10k+ parts

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2,670

$8.886

$7.287

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IDEA Electronic Components Group

UK . 1,055 parts In-Stock

1+ parts

$8.886

100+ parts

$8.442

1k+ parts

$7.997

10k+ parts

-

1,055

$8.886

$8.442

$7.997

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AZTECH Wire

Italy . 308 parts In-Stock

1+ parts

$9.575

100+ parts

-

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308

$9.575

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One Stop Electronics

USA . 1,413 parts In-Stock

1+ parts

$11.000

100+ parts

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1,413

$11.000

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Corphita

USA . 2,027 parts In-Stock

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2,027

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Overview

Unlock the power of innovation with the SN74AUP1G58DCKRG4 by Texas Instruments. This cutting-edge Other Function Logic IC offers unparalleled quality and reliability, backed by the industry-leading reputation of its manufacturer. With a wide range of applications, this product provides customers with immense value and advantages, making it an essential component for any project. Experience the benefits of superior performance and efficiency, all in a compact package that delivers on both functionality and durability. Elevate your designs with the SN74AUP1G58DCKRG4 and discover endless possibilities for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring it can withstand various environmental conditions.

Propagation Delay At Nominal Supply: 26.6 ns

The low propagation delay ensures fast signal processing, making the product suitable for time-sensitive applications.

Surface Mount: YES

Being surface mountable makes installation and integration of the product onto circuit boards easier and more efficient.

Nominal Supply Voltage / Vsup (V): 1.2

The low nominal supply voltage reduces power consumption, making the product energy-efficient.

Load Capacitance (CL): 30 pF

The load capacitance value indicates the maximum capacitance the product can drive, ensuring compatibility with various load requirements.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of supply voltages, making the product reliable and versatile.

Technical Specifications

Other Function Logic ICs SN74AUP1G58DCKRG4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

26.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

SN74AUP1G58DCKRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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