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SN54LS297FK

Texas Instruments

SN54LS297FK by Texas Instruments

SN54LS297FK by Texas Instruments is a TTL logic IC with 20 terminals, operating b/w -55°C to 125°C. It has a supply voltage range of 4.5V to 5.5V and comes in a square chip carrier package suitable for military-grade applications. This surface-mount IC is designed for various functions requiring reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,805 parts In-Stock

1+ parts

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6,805

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Digiode

USA . 641 parts In-Stock

1+ parts

-

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-

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641

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 861 parts In-Stock

1+ parts

$13.669

100+ parts

-

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861

$13.669

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Parana Technologies

USA . 592 parts In-Stock

1+ parts

$27.143

100+ parts

$2,520.660

1k+ parts

$24.429

10k+ parts

-

592

$27.143

$2,520.660

$24.429

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DigiPath Technology Company

USA . 1,765 parts In-Stock

1+ parts

$29.888

100+ parts

$27.497

1k+ parts

-

10k+ parts

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1,765

$29.888

$27.497

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ChromeModa Solutions

Germany . 2,443 parts In-Stock

1+ parts

$30.498

100+ parts

$25.008

1k+ parts

-

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2,443

$30.498

$25.008

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IDEA Electronic Components Group

UK . 140 parts In-Stock

1+ parts

$30.498

100+ parts

$28.973

1k+ parts

$27.448

10k+ parts

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140

$30.498

$28.973

$27.448

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One Stop Electronics

USA . 1,605 parts In-Stock

1+ parts

$49.000

100+ parts

-

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1,605

$49.000

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Corphita

USA . 650 parts In-Stock

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650

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Overview

Unlock the power of reliable and high-quality logic ICs with the SN54LS297FK by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch performance and durability in all their products. The SN54LS297FK is perfect for a wide range of applications in various electronic devices. Experience the value and benefits of this product, from its superior construction using ceramic and metal-sealed materials to its efficient operation at both high and low temperatures. Trust Texas Instruments to deliver innovation and excellence with the SN54LS297FK.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material choice provides excellent durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Nominal Supply Voltage: 5V

The 5V supply voltage is commonly used in many electronic systems, making this product compatible with a wide range of applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability even in demanding environments where temperatures can fluctuate.

Technology: TTL

The TTL technology offers high-speed performance and compatibility with other TTL-based components, making it a versatile choice for various projects.

Technical Specifications

Other Function Logic ICs SN54LS297FK attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

S-CQCC-N20

Logic IC Type:

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN54LS297FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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