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SNC55325J

Texas Instruments

SNC55325J by Texas Instruments

SNC55325J by Texas Instruments is a MIL-STD-883 Class B (Modified) rated IC with 16 terminals, operating b/w -55°C to 125°C. It features power supplies of 5V and 24V, suitable for military-grade applications due to its bipolar technology and ceramic package body material. The rectangular in-line package style with through-hole terminals makes it ideal for robust electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,707 parts In-Stock

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Vyrian

USA . 3,499 parts In-Stock

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3,499

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Electronic Expediters

USA . 4 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 3 parts In-Stock

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Resion

USA . 1 parts In-Stock

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AZTECH Wire

Italy . 673 parts In-Stock

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$11.082

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Parana Technologies

USA . 2,024 parts In-Stock

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$17.602

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$17.795

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One Stop Electronics

USA . 868 parts In-Stock

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$18.000

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DigiPath Technology Company

USA . 1,957 parts In-Stock

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$19.382

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IDEA Electronic Components Group

UK . 2,150 parts In-Stock

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$19.778

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$18.789

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$17.800

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ChromeModa Solutions

Germany . 845 parts In-Stock

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$19.778

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$16.218

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Corphita

USA . 2,941 parts In-Stock

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Overview

Enhance your electronic projects with the high-quality SNC55325J by Texas Instruments. Known for their reliability and innovation, Texas Instruments delivers top-notch products like this one in the category of Other Function Logic ICs. With a MIL-STD-883 Class B screening level and military-grade temperature grade, this IC ensures optimal performance in extreme conditions. Its versatile applications make it a valuable asset for engineers and hobbyists alike. Upgrade your designs with the SNC55325J and experience the unmatched benefits and advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides high thermal conductivity and durability, making the product reliable in harsh operating conditions.

Screening Level: MIL-STD-883 Class B (Modified)

Compliance with MIL-STD-883 Class B (Modified) ensures high quality and reliability in critical applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on a PCB and aids in easy integration into existing designs.

Power Supplies (V): 5,24

Support for multiple power supply voltages (5V and 24V) provides flexibility in different system configurations.

No. of Terminals: 16

Higher number of terminals allows for more connections and functionalities, making the product versatile.

Package Style (Meter): IN-LINE

In-line package style simplifies the layout and wiring, reducing complexity in system assembly.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance in applications where temperature fluctuations are common.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for operation in very cold environments without compromising performance.

Terminal Position: DUAL

Dual terminal position provides redundancy and improved connectivity, increasing the product's reliability.

Temperature Grade: MILITARY

Military-grade temperature rating ensures the product can withstand harsh environmental conditions and maintain consistent performance.

Technology: BIPOLAR

Bipolar technology offers high-speed operation and low power consumption, ideal for applications that require quick response times.

Terminal Form: THROUGH-HOLE

Through-hole terminal form offers strong mechanical support and ease of soldering, ensuring secure connections in the system.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54 mm enables compatibility with commonly used connectors and PCB layouts, simplifying integration.

Technical Specifications

Other Function Logic ICs SNC55325J attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5,24

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Other Logic ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNC55325J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-619-1078, 5962006191078

NIIN

006191078

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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