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SNC54LS444J

Texas Instruments

SNC54LS444J by Texas Instruments

SNC54LS444J by Texas Instruments is a MIL-STD-883 Class B (Modified) TTL logic IC with 20 terminals, operating b/w -55°C to 125°C. It has a nominal voltage of 5V and is commonly used in military-grade applications due to its ceramic package body material and through-hole terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,409 parts In-Stock

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Digiode

USA . 4,186 parts In-Stock

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4,186

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Distributors (Availability)

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AZTECH Wire

Italy . 544 parts In-Stock

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$8.836

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544

$8.836

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Parana Technologies

USA . 1,343 parts In-Stock

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$13.742

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$14.229

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$13.742

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$14.229

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ChromeModa Solutions

Germany . 4,428 parts In-Stock

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$15.440

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$12.661

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4,428

$15.440

$12.661

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IDEA Electronic Components Group

UK . 366 parts In-Stock

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$15.440

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$14.668

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$13.896

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366

$15.440

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$13.896

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One Stop Electronics

USA . 1,174 parts In-Stock

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$31.000

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$31.000

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Corphita

USA . 1,822 parts In-Stock

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1,822

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DigiPath Technology Company

USA . 732 parts In-Stock

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$13.921

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732

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$13.921

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Overview

Unlock the power of advanced technology with the SNC54LS444J by Texas Instruments. Crafted with precision and quality, this Other Function Logic IC is designed to deliver unparalleled performance in a variety of applications. From military-grade operations to industrial automation, this product offers reliable and efficient solutions that exceed expectations. Experience the value and benefits of cutting-edge technology with the SNC54LS444J, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides good mechanical protection and thermal conductivity, making the product durable and reliable.

Screening Level: MIL-STD-883 Class B (Modified)

Compliance with this military standard ensures high reliability and quality standards for the product.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with a wide range of systems and applications.

Maximum Operating Temperature: 125 °C

Being able to operate at high temperatures of up to 125°C allows for use in harsh environments without compromising performance.

Minimum Operating Temperature: -55 °C

Ability to operate at low temperatures of -55°C ensures reliability in cold conditions.

Temperature Grade: MILITARY

Military-grade temperature tolerance and reliability make this product suitable for demanding applications and environments.

Technology: TTL

TTL technology offers high-speed operation and compatibility with existing TTL systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections on PCBs, ensuring stability during operation.

Technical Specifications

Other Function Logic ICs SNC54LS444J attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Other Logic ICs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNC54LS444J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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