Loading...

SN74AUP1G97DBVTE4

Texas Instruments

SN74AUP1G97DBVTE4 by Texas Instruments

SN74AUP1G97DBVTE4 by Texas Instruments is a CMOS logic IC with 26.7 ns propagation delay, 30 pF load capacitance, and 1.2/3.3 V power supplies. It features a Schmitt Trigger and 3-STATE output characteristics, suitable for industrial applications requiring fast response times in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,638 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,638

-

-

-

-

Digiode

USA . 4,485 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,485

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 259 parts In-Stock

1+ parts

$7.286

100+ parts

-

1k+ parts

-

10k+ parts

-

259

$7.286

-

-

-

Parana Technologies

USA . 1,921 parts In-Stock

1+ parts

$10.789

100+ parts

$1,001.883

1k+ parts

$9.710

10k+ parts

-

1,921

$10.789

$1,001.883

$9.710

-

One Stop Electronics

USA . 660 parts In-Stock

1+ parts

$11.000

100+ parts

-

1k+ parts

-

10k+ parts

-

660

$11.000

-

-

-

DigiPath Technology Company

USA . 128 parts In-Stock

1+ parts

$11.880

100+ parts

$10.929

1k+ parts

-

10k+ parts

-

128

$11.880

$10.929

-

-

ChromeModa Solutions

Germany . 3,323 parts In-Stock

1+ parts

$12.122

100+ parts

$9.940

1k+ parts

-

10k+ parts

-

3,323

$12.122

$9.940

-

-

IDEA Electronic Components Group

UK . 320 parts In-Stock

1+ parts

$12.122

100+ parts

$11.516

1k+ parts

$10.910

10k+ parts

-

320

$12.122

$11.516

$10.910

-

Corphita

USA . 2,171 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,171

-

-

-

-

Overview

Enhance your electronic designs with the SN74AUP1G97DBVTE4 by Texas Instruments, a leading manufacturer known for top-quality products. This versatile Other Function Logic IC offers fast propagation delay, low power consumption, and a wide operating temperature range, making it ideal for various applications. With a compact package and 3-state output characteristics, this IC provides value and efficiency to your projects. Trust Texas Instruments to deliver reliable solutions for your design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material offers durability and protection to the internal components, making the product reliable and long-lasting.

Propagation Delay At Nominal Supply: 26.7 ns

Low propagation delay ensures fast and efficient operation of the logic IC, making it suitable for applications where timing is critical.

Surface Mount: YES

Surface mount capability makes installation and soldering easy and efficient, saving time and effort during production.

Nominal Supply Voltage / Vsup (V): 1.2

Operating at a low nominal supply voltage of 1.2V makes the logic IC energy-efficient and suitable for battery-powered applications.

Load Capacitance (CL): 30 pF

With a low load capacitance, the IC can drive capacitive loads efficiently without performance degradation.

Power Supplies (V): 1.2/3.3

Support for multiple power supply voltages allows flexibility in the application design and compatibility with different systems.

Maximum I (ol): 1.7 Amp

High output current capability of 1.7A allows the IC to drive external loads with ease, making it versatile for a variety of applications.

Output Characteristics: 3-STATE

3-STATE output characteristics enable the IC to have a high impedance output state, offering flexibility in controlling bus lines and reducing power consumption.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature support ensures reliable operation in harsh environments with varying temperature conditions, making it suitable for industrial applications.

Technical Specifications

Other Function Logic ICs SN74AUP1G97DBVTE4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

26.7 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

SN74AUP1G97DBVTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20