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SN74LVC1G58DBVRE4

Texas Instruments

SN74LVC1G58DBVRE4 by Texas Instruments

SN74LVC1G58DBVRE4 by Texas Instruments is a CMOS logic IC with 6.3ns propagation delay, 50pF load capacitance, and 3.3V power supply. It is used in industrial applications for its Schmitt Trigger feature, 3-STATE output characteristics, and small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,907 parts In-Stock

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Digiode

USA . 530 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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AZTECH Wire

Italy . 842 parts In-Stock

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$5.904

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842

$5.904

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Parana Technologies

USA . 1,944 parts In-Stock

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$17.098

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$17.314

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Corohmni

South Africa . 286 parts In-Stock

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$17.239

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DigiPath Technology Company

USA . 253 parts In-Stock

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$18.827

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ChromeModa Solutions

Germany . 6,483 parts In-Stock

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$19.211

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$15.753

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IDEA Electronic Components Group

UK . 1,200 parts In-Stock

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$18.250

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$17.290

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Ampacity Inc.

Singapore . 1,370 parts In-Stock

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One Stop Electronics

USA . 313 parts In-Stock

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Corphita

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Argo Parts USA

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Advanced Electronics

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Continental Prestige Electronics

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Bastille Electronics

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Overview

Enhance your electronic projects with the SN74LVC1G58DBVRE4 by Texas Instruments, a top-quality Other Function Logic IC that offers exceptional performance and reliability. Manufactured by Texas Instruments, a trusted name in the industry, this IC is perfect for various applications requiring precise signal processing. With a low supply voltage, high output current capability, and industrial-grade temperature range, this IC provides unmatched value and versatility. Upgrade your designs today with the SN74LVC1G58DBVRE4 and experience the benefits of superior quality and performance.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and reliability for the product.

Propagation Delay At Nominal Supply:

6.3 ns - Fast propagation delay ensures quick response times.

Surface Mount:

YES - Allows for easy and efficient installation on PCBs.

Package Shape:

RECTANGULAR - Compact shape for space-saving design.

Nominal Supply Voltage / Vsup (V):

1.8 - Low supply voltage for energy efficiency.

Load Capacitance (CL):

50 pF - Suitable for driving various loads.

Power Supplies (V):

3.3 - Compatible with common power sources.

No. of Terminals:

6 - Sufficient terminals for connections.

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH - Ideal for applications with limited space.

Maximum I (ol):

24 Amp - High output current capability.

Output Characteristics:

3-STATE - Offers flexibility in output configurations.

Minimum Operating Temperature:

40 °C - Operates reliably in low-temperature environments.

Terminal Finish:

NICKEL PALLADIUM GOLD - Ensures corrosion resistance and good conductivity.

Terminal Position:

DUAL - Allows for flexible mounting orientations.

Maximum Seated Height:

1.45 mm - Low profile design for compact installations.

Width:

1.6 mm - Slim width for space-efficient layouts.

Minimum Supply Voltage (Vsup):

1.65 V - Wide operating voltage range for versatility.

Maximum Time At Peak Reflow Temperature (s):

30 - Resistant to high-temperature soldering processes.

Peak Reflow Temperature °C:

260 - Withstands high-temperature assembly methods.

Length:

2.9 mm - Compact length for space-saving applications.

Temperature Grade:

INDUSTRIAL - Suitable for industrial operating conditions.

Schmitt Trigger:

YES - Provides hysteresis for noise immunity.

Technology:

CMOS - Low power consumption and high noise immunity.

Terminal Form:

GULL WING - Easy soldering and strong mechanical stability.

Packing Method:

TR - Suitable for tape and reel packaging for automated assembly.

Terminal Pitch:

0.95 mm - Fine pitch for high-density PCB layouts.

Maximum Supply Voltage (Vsup):

5.5 V - Wide supply voltage range for compatibility.

Technical Specifications

Other Function Logic ICs SN74LVC1G58DBVRE4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

SN74LVC1G58DBVRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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