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SN74TVC16222ADLG4

Texas Instruments

SN74TVC16222ADLG4 by Texas Instruments

SN74TVC16222ADLG4 by Texas Instruments is a 48-terminal logic IC with a supply voltage range of 0.6V to 5V, suitable for industrial applications. It operates b/w -40°C to 85°C and features true output polarity. The package style is small outline, shrink pitch, making it ideal for surface mount assembly in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,866 parts In-Stock

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7,866

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Digiode

USA . 1,986 parts In-Stock

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1,986

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 588 parts In-Stock

1+ parts

$17.967

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588

$17.967

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Parana Technologies

USA . 2,282 parts In-Stock

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$23.387

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$24.020

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2,282

$23.387

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$24.020

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DigiPath Technology Company

USA . 1,413 parts In-Stock

1+ parts

$25.751

100+ parts

$23.691

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1,413

$25.751

$23.691

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ChromeModa Solutions

Germany . 5,536 parts In-Stock

1+ parts

$26.277

100+ parts

$21.547

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5,536

$26.277

$21.547

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IDEA Electronic Components Group

UK . 1,324 parts In-Stock

1+ parts

$26.277

100+ parts

$24.963

1k+ parts

$23.649

10k+ parts

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1,324

$26.277

$24.963

$23.649

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One Stop Electronics

USA . 745 parts In-Stock

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$49.000

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745

$49.000

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Microchip USA

USA . 2,959 parts In-Stock

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Corphita

USA . 2,607 parts In-Stock

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2,607

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Overview

Unlock the potential of your electronic devices with the SN74TVC16222ADLG4 by Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliability and performance in every component they manufacture. This versatile Other Function Logic IC is perfect for a wide range of applications, offering customers value and benefits that will enhance their projects. Trust in Texas Instruments to provide you with the tools you need to succeed in today's fast-paced technological world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the logic IC, ensuring longevity and reliability.

Surface Mount: YES

The surface mount feature allows for easy and efficient integration onto circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 2.1

The nominal supply voltage of 2.1V ensures efficient power consumption and compatibility with various systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this logic IC can withstand harsh environmental conditions and operate reliably in industrial settings.

Technology: NMOS

The NMOS technology offers fast switching speeds and low power consumption, making this logic IC suitable for high-performance applications.

Technical Specifications

Other Function Logic ICs SN74TVC16222ADLG4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

GTL/TVC

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

.6 V

Nominal Supply Voltage / Vsup (V):

2.1

Surface Mount:

YES

Technology:

NMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.49 mm

Trade Compliance

SN74TVC16222ADLG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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