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SN74AUP1G99DCUTG4

Texas Instruments

SN74AUP1G99DCUTG4 by Texas Instruments

SN74AUP1G99DCUTG4 by Texas Instruments is a CMOS logic IC with 36.1ns propagation delay, 30pF load capacitance, and 1.7A max I (ol). It is used in industrial applications for its Schmitt Trigger feature, operates at temperatures from -40 to 85 °C, and has a small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,995 parts In-Stock

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Digiode

USA . 4,446 parts In-Stock

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4,446

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Distributors (Availability)

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AZTECH Wire

Italy . 692 parts In-Stock

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$7.341

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692

$7.341

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Parana Technologies

USA . 1,694 parts In-Stock

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$21.653

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$22.068

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$21.653

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$22.068

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IDEA Electronic Components Group

UK . 258 parts In-Stock

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$24.329

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$23.113

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$21.896

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258

$24.329

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$21.896

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ChromeModa Solutions

Germany . 238 parts In-Stock

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$24.329

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$19.950

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238

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$19.950

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One Stop Electronics

USA . 1,227 parts In-Stock

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$53.000

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Corphita

USA . 4,965 parts In-Stock

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Microchip USA

USA . 1,743 parts In-Stock

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DigiPath Technology Company

USA . 218 parts In-Stock

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$21.935

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$21.935

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Overview

Elevate your electronic designs with the SN74AUP1G99DCUTG4 by Texas Instruments. Crafted with precision and reliability, this logic IC offers unparalleled performance in various applications. From its advanced technology to its industrial-grade temperature grade, this product ensures optimal functionality and efficiency. With a compact design and versatile capabilities, the SN74AUP1G99DCUTG4 is the ideal choice for all your circuit needs. Experience the quality and innovation that Texas Instruments brings to the table, and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Propagation Delay At Nominal Supply: 36.1 ns

The low propagation delay ensures quick signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 1.1

The low nominal supply voltage of 1.1V results in lower power consumption and makes it suitable for use in energy-efficient devices.

Load Capacitance (CL): 30 pF

The low load capacitance ensures stable and reliable operation in various circuit configurations.

Temperature Grade: INDUSTRIAL

The industrial temperature grade designates that this product can operate reliably in a wide range of temperature environments, making it suitable for industrial applications.

Schmitt Trigger: YES

The inclusion of a Schmitt trigger helps in reducing noise and ensuring signal integrity, making this product suitable for applications requiring noise immunity.

Technology: CMOS

The CMOS technology used in this product offers low power consumption, high noise immunity, and fast switching speeds, making it a versatile choice for various electronic applications.

Technical Specifications

Other Function Logic ICs SN74AUP1G99DCUTG4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.3 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

36.1 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.9 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

SN74AUP1G99DCUTG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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