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SN74LS628FN

Texas Instruments

SN74LS628FN by Texas Instruments

SN74LS628FN by Texas Instruments is a TTL logic IC with 20 terminals in a square chip carrier package. It operates b/w 0-70°C with supply voltage range of 4.75-5.25V, suitable for commercial applications requiring other function logic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,707 parts In-Stock

1+ parts

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5,707

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Digiode

USA . 945 parts In-Stock

1+ parts

-

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945

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 578 parts In-Stock

1+ parts

$7.741

100+ parts

-

1k+ parts

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578

$7.741

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Parana Technologies

USA . 1,994 parts In-Stock

1+ parts

$13.208

100+ parts

-

1k+ parts

$13.712

10k+ parts

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1,994

$13.208

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$13.712

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DigiPath Technology Company

USA . 1,124 parts In-Stock

1+ parts

$14.543

100+ parts

$13.380

1k+ parts

-

10k+ parts

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1,124

$14.543

$13.380

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ChromeModa Solutions

Germany . 6,641 parts In-Stock

1+ parts

$14.840

100+ parts

$12.169

1k+ parts

-

10k+ parts

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6,641

$14.840

$12.169

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IDEA Electronic Components Group

UK . 949 parts In-Stock

1+ parts

$14.840

100+ parts

$14.098

1k+ parts

$13.356

10k+ parts

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949

$14.840

$14.098

$13.356

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One Stop Electronics

USA . 1,022 parts In-Stock

1+ parts

$31.000

100+ parts

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1,022

$31.000

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Corphita

USA . 3,657 parts In-Stock

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3,657

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Overview

Enhance your electronic projects with the SN74LS628FN from Texas Instruments, a leader in semiconductor manufacturing. This versatile Other Function Logic IC offers reliable performance and compatibility with a wide range of applications. With a nominal supply voltage of 5V and commercial-grade temperature specifications, this chip carrier package provides stability and efficiency. Trust Texas Instruments for quality products that deliver value and innovation to your designs. Upgrade your circuits with the SN74LS628FN today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and provides good protection for the internal components of the IC.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 5

With a standard supply voltage of 5V, this IC is compatible with many common electronic systems.

No. of Terminals: 20

Having 20 terminals allows for a variety of inputs and outputs, making this IC versatile in its applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance in a range of environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for use in cold environments without risk of malfunction.

Technology: TTL

TTL technology is known for its robustness and compatibility with a wide range of digital systems.

Technical Specifications

Other Function Logic ICs SN74LS628FN attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

S-PQCC-J20

Logic IC Type:

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74LS628FN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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